2015
DOI: 10.1117/12.2077217
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Thin glass processing with various laser sources

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Cited by 3 publications
(2 citation statements)
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“…The fracture must start at the edge of the material where a crack is already present. This method is unsuitable for thin ceramics as the rapid heating of the substrate can cause stray fracture due to lateral heat diffusion causing thermal stress outside the desired region . Ultrashort pulse lasers are more suitable for scribing brittle materials due to nonlinear absorption mechanisms and minimal thermal effects .…”
Section: Introductionmentioning
confidence: 99%
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“…The fracture must start at the edge of the material where a crack is already present. This method is unsuitable for thin ceramics as the rapid heating of the substrate can cause stray fracture due to lateral heat diffusion causing thermal stress outside the desired region . Ultrashort pulse lasers are more suitable for scribing brittle materials due to nonlinear absorption mechanisms and minimal thermal effects .…”
Section: Introductionmentioning
confidence: 99%
“…Ablative cutting techniques are possible by repeatedly scanning a focused laser along the material surface. The edge quality of ablative cuts is reasonable, however, processing speeds are poor . Techniques for improving processing speeds have been developed, but speeds remain uneconomical …”
Section: Introductionmentioning
confidence: 99%