Thin Thermal Management Modules Using Flattened Heat Pipes and Piezoelectric Fans for Electronic Devices

Singh, Randeep; Velardo, Jason; Ahamed, Mohammad Shahed; Mochizuki, Masahito; Date, Abhijit; Akbarzadeh, Aliakbar

doi:10.5098/hmt.17.1

Cited by 3 publications

(1 citation statement)

References 24 publications

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“…Jaluria et al (2020) have presented steady and transient heat transfer from data centers for its thermal management and reduced energy consumption by optimizing the cooling strategy. Singh et al (2021) studied next generation high performance thin thermal management technologies using flattened heat pipe and piezoelectric fan. They used 1-6 mm thick modules for cooling of compact and portable electronic devices dissipating heat ranging from 3 -68 W. The investigators found reductions from 48 W at 2.0 mm to 7 W at 0.8 mm.…”

Section: Introductionmentioning

confidence: 99%

Study of Substrate Conductance Effect on Cooling of Electronic Components

Durgam¹

2022

Front. Heat Mass Transf.

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This article explores experimentally and numerically the effect of conductance on cooling of electronic chips by forced air flow in a vertical channel for thermal control. Experiments are conducted using substrates of FR4, bakelite, copper clad board (single layer) equipped with aluminum heat sources at uniform heat fluxes of 1000, 2000, and 3000 W/m 2 at 500 ≤ Re ≤ 1500. Computer simulations are performed to validate experimental results using a finite element method based COMSOL Multiphysics 4.3b software and the results are in agreements of below 10%. The temperatures obtained showed high thermal conductance copper clad boards (CCBs) are very low compared to FR4 and bakelite substrates. Results showed that FR4 and bakelite are unsuitable for airflow velocity of 0.6 m/s and heat flux of 3000 W/m 2 . However, the temperature variation between single and multilayer CCB is 3 to 4 • C. The temperature reduction using CCB is 10 • C compared to FR4 and bakelite.

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Section: Introductionmentioning

confidence: 99%

Study of Substrate Conductance Effect on Cooling of Electronic Components

Durgam¹

2022

Front. Heat Mass Transf.

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Study of the effect of tilt angle on the vaporization processes in a flat gravity heat pipe with a threaded evaporator

Nikolaenko

Melnyk

Lipnitskyi

et al. 2023

J Therm Anal Calorim

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Heat transfer characteristics of miniature heat pipes for cooling systems for electronics

Kravets,

Khairnasov,

Romashchenko

et al. 2023

TKEA

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Decrease in mass and dimensional characteristics of semiconductor devices with simultaneous increase in allocated power dissipation creates conditions of heat-loaded operation of the most critical elements of radio-electronic equipment. Such growth of heat flows requires effective small-size systems for maintaining safe temperature conditions of electronic equipment and its reliable functioning. The use of miniature heat pipes (MHP) commensurate in size with the microchip crystals can significantly reduce their temperature level of operation. The paper presents the experimental results of investigation of thermal resistance and maximum heat fluxes of miniature heat pipes with diameters from 3 to 6 mm and lengths from 150 to 300 mm with metal-fiber capillary structure. The porosity of the capillary structure varied from 70% to 88%. Water and ethanol were used as coolants. The study was carried out at different orientations of MHPs in space: vertical by gravity forces, horizontal, and vertical against gravity forces (+90°, 0°, –90°). It is shown that the heat transfer characteristics of the MHPs are affected by both geometric and mode factors. It is determined that the minimum thermal resistance and maximum heat flux significantly depend on the diameter of the vapor channel, porosity of the capillary structure and thermal physical properties of the heat transfer medium. The data on the heat transfer intensity in the heating zone depending on the size of the vapor channel are given. It is shown that decreasing the diameter of the vapor space of MHPs worsens their heat transfer characteristics.

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Thin Thermal Management Modules Using Flattened Heat Pipes and Piezoelectric Fans for Electronic Devices

Cited by 3 publications

References 24 publications

Study of Substrate Conductance Effect on Cooling of Electronic Components

Study of Substrate Conductance Effect on Cooling of Electronic Components

Study of the effect of tilt angle on the vaporization processes in a flat gravity heat pipe with a threaded evaporator

Heat transfer characteristics of miniature heat pipes for cooling systems for electronics

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