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Purpose The purpose of this paper is to consider a two-dimensional unsteady Casson magneto-nanfluid flow over an inclined plate embedded in a porous medium. The novelty of the present study is to investigate the effects of Soret–Dufour on unsteady magneto-nanofluid flow. Design/methodology/approach Appropriate similarity transformations are used to convert the governing non-linear partial differential equations into coupled non-linear dimensionless partial differential equations. The transformed equations are then solved using spectral relaxation method. Findings The effects of controlling parameters on flow profiles is discussed and depicted with the aid of graphs. Results show that as the non-Newtonian Casson nanofluid parameter increases, the fluid velocity decreases. It is found that the Soret parameter enhance the temperature profile, while Dufour parameter decreases the concentration profile close to the wall. Originality/value The novelty of this paper is to consider the combined effects of both Soret and Dufour on unsteady Casson magneto-nanofluid flow. The present model is in an inclined plate embedded in a porous medium which to the best of our knowledge has not been considered in the past. The applied magnetic field gives rise to an opposing force which slows the motion of the fluid. A newly developed spectral method known as spectral relaxation method (SRM) is used in solving the modeled equations. SRM is an iterative method that employ the Gauss–Seidel approach in solving both linear and non-linear differential equations. SRM is found to be effective and accurate.

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Heat pipes are recognized as an excellent heat transport devices and extensively investigated for applications in electronic cooling. Different types of heat pipes have been developed such as micro/miniature heat pipes, loop heat pipes and so on, and these heat pipes have been widely applied in the field of electronics cooling such as notebook, desktop, data center; as well as aerospace, industrial cooling field. However, in recent years the application of heat pipe is widening to the filed of hand held mobile electronic devices such as smart phone, tablet pc, digital camera etc. With the development in technology these devices have different user friendly functions and capabilities, which requires the highest processor clock speed. In general, high clock speed of processor generates lot of heat which need to be spread or removed to eliminate the hot spot. It becomes a challenging task to cool such electronic devices as mentioned above with a very confined space and concentrated heat sources. Regarding to this challenge, ultra thin flat heat pipe is developed; this newly developed heat pipe consists of a special fiber wick structure which can ensure vapor spaces on the two sides of the wick structure. In this paper a novel thin spreader is proposed to eliminate the hot spot; generally the proposed heat spreader consists of 0.20mm thick metal plate and ultra thin heat pipe of 0.40mm thickness soldered in its body. Maximum thickness of this spreader is 0.63mm. Metal plate is 60mm × 110mm in size; and the ultra thin heat pipe can be fabricated from different original diameter ranges from 2.0mm to 3.0mm Cu tube. Theoretical and experimental analysis have been done to evaluate this thin spreader. In addition, some real application of this spreader will be introduced in this paper.