Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices

Ahamed, Mohammad Shahed; Saito, Yuji; Mashiko, Koichi; Mochizuki, Masahito

doi:10.1007/s00231-017-2022-7

Cited by 62 publications

(9 citation statements)

References 6 publications

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“…The structure of the heat pipe was made by flattening a copper tube, and the size of the flattened heat pipe was 100 mm (length) × 3 mm (width) × 0.4 mm (thickness). Ahamed et al (2017) disclosed extended experimental results on the thermal performance of the ultra-thin flattened heat pipe. In this experiment, a length, a width and a thickness of the heat pipe were changed as 50 mm -120 mm, 3.0 mm -7.8 mm and 0.35 mm -0.60 mm, respectively.…”

Section: Introductionmentioning

confidence: 90%

Numerical Analyses on Vapor Pressure Drop in a Centered-Wick Ultra-Thin Heat Pipe

Koito¹

2019

Frontiers in Heat and Mass Transfer

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This paper describes extended numerical analyses on vapor pressure distribution in a centered-wick ultra-thin heat pipe. Analyses were conducted by using a three-dimensional model developed by the author. Numerical results were obtained changing design parameters and operating conditions of the heat pipe. Discussion was made on the heat transfer limit as well as the vapor pressure drop. Moreover, a simple method was also presented to evaluate the vapor pressure drop in the ultra-thin heat pipe. Calculated results with the simple method agreed in 10 % with the three-dimensional numerical results.

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Section: Introductionmentioning

confidence: 90%

Numerical Analyses on Vapor Pressure Drop in a Centered-Wick Ultra-Thin Heat Pipe

Koito¹

2019

Frontiers in Heat and Mass Transfer

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“…This is being made possible due to the development of high-performance ultrathin heat pipe devices integrated into such small form-factor devices. Ultrathin flat heat pipes and loop heat pipes with thicknesses in the ranges of 0.35-0.6 mm and 0.6 mm-1.2 mm, respectively, were demonstrated for practical applications [100][101][102]. As portable devices involve user-interactive applications that lead to intermittent short computational bursts followed by long idle times, transient thermal analyses of heat pipes/vapor chambers under varying workloads become important.…”

Section: Metallic Phase Change Materialsmentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

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“…Moreover, the displays of smartphones and smartwatches consume power [20,21]. Consequently, several heat dissipation methods for smartphones have been proposed [22,23]. Although current smartwatches have comparatively low power due to their limited battery capacity, performance and functions on par with those of smartphones are expected in the near future.…”

Section: Introductionmentioning

confidence: 99%

Receiver coil built into belt for heat dissipation of watch-type smart devices

Kashiwazaki

Hachiya

Kanamoto

et al. 2022

IEICE Electron. Express

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This letter proposes a novel method to promote the heat dissipation of watch-type smart devices by using receiver coils for wireless charging. It is achieved by embedding a spiral coil inside the belt. The heat dissipation effects of the proposed method on temperatures at key hot spots are clarified. The power transfer efficiency is also clarified. In watch-type smart devices, the most critical part for temperature is the underside surface of the belt, since this is the part that touches the skin for a long time. The analysis results show that the proposed method can reduce the increase in ambient temperature at the belt's underside surface by 59.7% and that its power transfer efficiency is more than 90%.

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Characterization of a high performance ultra-thin heat pipe cooling module for mobile hand held electronic devices

Cited by 62 publications

References 6 publications

Numerical Analyses on Vapor Pressure Drop in a Centered-Wick Ultra-Thin Heat Pipe

Numerical Analyses on Vapor Pressure Drop in a Centered-Wick Ultra-Thin Heat Pipe

A Review On Transient Thermal Management of Electronic Devices

Receiver coil built into belt for heat dissipation of watch-type smart devices

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