Thinfilm Multilayer Technology for Microwave Applications

Ferling, Dieter; Richter, H.J.

doi:10.1109/euma.1994.337236

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Thin Film Multilayer Technology1

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Cited by 2 publications

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“…In this case vias with 200"m diameter for 635"m thick ceramics were used. For practical reasons it is advantageous to use circular substrates in case of processing very thick dielectrics (Ferling and Richter, 1994;Data sheet, 1993). For the interconnects between the different metallization levels vias in the polyimide with 70"m diameter were used.…”

Section: Thin Film Multilayer Technologymentioning

confidence: 99%

Substrate integrated packaging for RF‐applications

Richter

Ferling

Buchali

et al. 2000

Microelectronics International

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In this paper, Substrate Integrated Packaging (SIP) based on thin film multilayer technology is presented. Coplanar waveguide feedthroughs calculated with 3D‐Finite Differential Methods were manufactured using a ceramic or silicon carrier, gold conductors and polyimide as dielectric. The substrate integrated packages were realized with metallic frames and lids mounted on the thin film circuitry. S‐parameter measurements show the superior quality of the feedthroughs. To verify the new packaging concept, a 10GHz and a 58GHz amplifier module were realized. From these modules the potential of the SIP‐technology is demonstrated.

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Section: Thin Film Multilayer Technologymentioning

confidence: 99%