2016
DOI: 10.1007/s11837-016-2042-7
|View full text |Cite
|
Sign up to set email alerts
|

Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(1 citation statement)
references
References 19 publications
0
1
0
Order By: Relevance
“…Micro X-ray computed tomography (µ-XCT) imaging offers a non-destructive spatial analysis of materials and parts [ 18 ]. It was applied on solder materials to investigate several microstructural features such reflow porosities [ 19 , 20 , 21 ] or phase morphology [ 22 , 23 , 24 , 25 , 26 ]. The size distribution of spherical reflow porosities in solder joints was reported by Jiang et al [ 19 ] and Rauer et al [ 20 ].…”
Section: Introductionmentioning
confidence: 99%
“…Micro X-ray computed tomography (µ-XCT) imaging offers a non-destructive spatial analysis of materials and parts [ 18 ]. It was applied on solder materials to investigate several microstructural features such reflow porosities [ 19 , 20 , 21 ] or phase morphology [ 22 , 23 , 24 , 25 , 26 ]. The size distribution of spherical reflow porosities in solder joints was reported by Jiang et al [ 19 ] and Rauer et al [ 20 ].…”
Section: Introductionmentioning
confidence: 99%