Three-dimensional Finite Element Analysis of Thermomechanical Behavior in                 Flip-chip Packages under Temperature Cycling Conditions

Wu, Gien-Huang; Tsein, T. C.; Ju, Shen-Haw

doi:10.1177/0731684405054333

Cited by 4 publications

(2 citation statements)

References 7 publications

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“…This under fill then acts as a thermal stress absorber around the solder balls, thereby reducing stress on the solder joints and improving fatigue life. The problem with this is that they most under fill materials have a tendency to absorb moisture the problem with this is that most under fill materials have a tendency to absorb moisture during preconditioning/storage [4]. Thermal Stresses are induced in electronic packages during various stages of their lifecycle.…”

Section: Literature Survey On Flip Chip Ball Grid Arraymentioning

confidence: 99%

Determination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review

Patil¹,

Waghmare²

2015

IJERT

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In todays advanced electrical technology, it becomes necessity to use compact semiconductor chips in variety of areas like computers, electrical appliances, automotive etc., clearly the need of more and more sophisticated packages is increasing. As the need of faster computer increases design of denser and more complicated packages becomes unavoidable, more complicated packages means that, the size of chip more or less remains same, but it has more electronic circuitry per unit surface area, this, of course increases the temperature of packages and causes thermal expansion due to change in coefficient of thermal expansion of the constituent materials. Thermal stresses ultimately cause the failure of the device. An IC package mainly consist of four parts, silicon die (chip), polymeric substrate, plastic molding compound and connectivity parts, lead frames and bond wires. The silicon chip is assembled on a polymeric substrate, plastic molding compound surrounding both parts, lead frames and bond wires provide electrical connectivity between the package and board on which assembly is made. The complicated geometrical structure and different material properties as well as the loading conditions made it almost impossible to study the mechanical behavior of semiconductor package analytically; therefore the finite element method has become a useful tool for evaluation of problems encountered in this area.

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Section: Literature Survey On Flip Chip Ball Grid Arraymentioning

confidence: 99%

Determination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review

Patil¹,

Waghmare²

2015

IJERT

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“…Various thermal enhancements have been developed for the basic FC-PBGA package to improve thermal performance. Gugliermermetti and Grignaffini [2] analyzed theoretically the thermal performance of parallel stacks of in-line plate fin heat sinks. They reported that a fin efficiency parameter, like that used for constant cross-section fin in an isothermal fluid flow, can be introduced to express both the local and overall heat transfer balances.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly

Lin¹,

Wu²,

Ju³

2013

JECTC

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In this paper, three-dimensional finite element analysis using the commercial ANSYS software is performed to study the thermal performance of a thermally enhanced FC-PBGA (flip-chip plastic ball grid array) assembly in both natural and forced convection environments. The thermally enhanced FC-PBGA assembly is a basic FC-PBGA assembly with a lid attached on top, after which an extruded-fin heatsink is attached on the top of the lid. The finite element model is complete enough to include key elements such as bumps, solder balls, substrate, printed circuit board, extruded-fin heatsink, lid, vias, TIM1 (thermal interface material 1), TIM2 (thermal interface material 2), lid-substrate adhesive and ground planes for both signal and power. Temperature fields are simulated and presented for several package configurations. Thermal resistance is calculated to characterize and compare the thermal performance by considering alternative design parameters of the polymer-based materials and the thermal enhancement components. The polymer-based materials include underfill, TIM1, TIM2, lid-substrate adhesive and substrate core material. The specific thermal enhancement components are the extruded-fin heatsink and the lid.

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Time dependent singular behaviours at interface edges of chip

Zhu

Feng

2011

Materials Research Innovations

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Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

Cited by 4 publications

References 7 publications

Determination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review

Determination of Thermal Induced Stresses in Semiconductor Chip Package by using Finite Element Analysis: A Brief Review

Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly

Time dependent singular behaviours at interface edges of chip

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