Three-Dimensional Inductance Computations with Partial Element Equivalent Circuits

Brennan, P.A.; Raver, N.; Ruehli, Albert E.

doi:10.1147/rd.236.0661

Cited by 102 publications

(25 citation statements)

References 8 publications

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“…Although only the inductance of circular loop is computed and compared with the experimental data, the inductance of lumped elements can be predicted with reasonable accuracy [30][31][32][33][34][35][36].…”

Section: Measured Inductancementioning

confidence: 99%

Development of a resonant repeater tag for the enhancement of sensitivity and specificity in a wireless eddy current sensing scheme

et al. 2006

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Section: Measured Inductancementioning

confidence: 99%

Development of a resonant repeater tag for the enhancement of sensitivity and specificity in a wireless eddy current sensing scheme

et al. 2006

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“…The form of the 3 3 matrix and the scalar Green's functions depend on the gauge chosen [16]. We choose for the representation in [14] where (4) Note that, in (2) and (3), the dependence on the Green's functions on frequency is not shown explicitly.…”

Section: A Mpiesmentioning

confidence: 99%

Mixed-Potential Volume Integral-Equation Approach for Circular Spiral Inductors

Rejaei

2004

IEEE Trans. Microwave Theory Techn.

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Abstract-The electromagnetic behavior of circular spiral inductors on layered substrates is analyzed by using the concentric ring approximation. The problem is formulated in terms of mixedpotential volume integral equations. The latter are semianalytically solved within the quasi-one-dimensional approximation. The result is a fast computationally efficient model, which takes into account substrate RF loss, as well as nonuniform current density distribution across inductor windings. The results are in good agreement with experimental data from various inductors on both low-and high-resistivity silicon substrates.

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“…IBM was a pioneer in the analysis of coupling noise, delta-I noise, and timing delay which occur due to interconnect parasitics. Static capacitance and inductance computations which result in networks that could be simulated practically, were first computed using the partial element equivalent circuit (PEEC) method [59]- [62]. These were used for on-chip and off-chip delay, coupling, and delta-I noise calculations.…”

Section: ) Circuit Simulationmentioning

confidence: 99%

EDA in IBM: past, present, and future

Darringer

Davidson

Hathaway

et al. 2000

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Throughout its history, from the early four-circuit gate-array chips of the late 1960s to today's billion-transistor multichip module, IBM has invested in tools to support its leading-edge technology and high-performance product development. The combination of demanding designs and close cooperation among product, technology, and tool development has given rise to many innovations in the electronic design automation (EDA) area and provided IBM with a significant competitive advantage. This paper highlights IBM's contributions over the last four decades and presents a view of the future, where the best methods of multimillion gate ASIC and gigahertz microprocessor design are converged to enable highly productive system-on-a-chip designs that include widely diverse hardware and software components.

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Three-Dimensional Inductance Computations with Partial Element Equivalent Circuits

Cited by 102 publications

References 8 publications

Development of a resonant repeater tag for the enhancement of sensitivity and specificity in a wireless eddy current sensing scheme

Development of a resonant repeater tag for the enhancement of sensitivity and specificity in a wireless eddy current sensing scheme

Mixed-Potential Volume Integral-Equation Approach for Circular Spiral Inductors

EDA in IBM: past, present, and future

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