Three-dimensional integrated stretchable electronics

Huang, Zhenlong; Hao, Yifei; Li, Yang; Hu, Hongjie; Wang, Chonghe; Nomoto, Akihiro; Pan, Taisong; Gu, Yue; Chen, Yimu; Zhang, Tianjiao; Li, Weixin; Lei, Yusheng; Kim, Nam-Heon; Wang, Chunfeng; Zhang, Lin; Ward, Jeremy W.; Maralani, Ayden; Li, Xiaoshi; Durstock, Michael F.; Pisano, Albert P.; Lin, Yuan; Xu, Sheng

doi:10.1038/s41928-018-0116-y

Cited by 427 publications

(391 citation statements)

References 35 publications

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“…[1][2][3][4][5] As an energy storage device and circuit element, supercapacitor has been widely investigated in the last two decades as a discrete component. 3D integration enables short interconnection distance and more compact size.…”

Section: Introductionmentioning

confidence: 99%

Monolithic Integration of All‐in‐One Supercapacitor for 3D Electronics

Wang

Cai

et al. 2019

Advanced Energy Materials

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A supercapacitor is usually stacked in the configuration of a layered sandwiched architecture, and has been adopted as discrete energy storage device or circuit component. However, this stacked structure decreases mechanical integrity, leads to low specific capacity, and prevents high‐density monolithic integration. Here all‐in‐one supercapacitors are fabricated by integrating cathode, anode, current collector, and separator into one monolithic glass fiber (GF) substrate together with other circuit components through matured and scalable fabrication techniques, the all‐in‐one supercapacitor is embedded as a component for 3D electronics. This all‐in‐one architecture demonstrates its effectiveness in the prevention of the delamination of the sandwiched supercapacitor and the minimization of the proportion of inactive materials. The supercapacitor delivers high power density (320 mW cm−3) and energy density (2.12 mWh cm−3), and exhibits a capacitance retention of 100% even after a continuous cycling of 431 h. Furthermore, a 3D polydimethylsiloxane/GF architecture is constructed for driving a flash light emitting diode system, where the all‐in‐one supercapacitor is monolithically integrated in the 3D system, and each layer is connected via vertical through‐holes. This all‐in‐one device can be constructed with a macroscopically available membrane and readily integrated into 3D systems without secondary packaging, providing the potential for high‐density heterogeneous 3D electronics.

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Section: Introductionmentioning

confidence: 99%

Monolithic Integration of All‐in‐One Supercapacitor for 3D Electronics

Wang

Cai

et al. 2019

Advanced Energy Materials

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Section: System Integrationmentioning

confidence: 99%

Cyber–Physiochemical Interfaces

et al. 2020

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Living things rely on various physical, chemical, and biological interfaces, e.g., somatosensation, olfactory/gustatory perception, and nervous system response. They help organisms to perceive the world, adapt to their surroundings, and maintain internal and external balance. Interfacial information exchanges are complicated but efficient, delicate but precise, and multimodal but unisonous, which has driven researchers to study the science of such interfaces and develop techniques with potential applications in health monitoring, smart robotics, future wearable devices, and cyber physical/human systems. To understand better the issues in these interfaces, a cyber–physiochemical interface (CPI) that is capable of extracting biophysical and biochemical signals, and closely relating them to electronic, communication, and computing technology, to provide the core for aforementioned applications, is proposed. The scientific and technical progress in CPI is summarized, and the challenges to and strategies for building stable interfaces, including materials, sensor development, system integration, and data processing techniques are discussed. It is hoped that this will result in an unprecedented multi‐disciplinary network of scientific collaboration in CPI to explore much uncharted territory for progress, providing technical inspiration—to the development of the next‐generation personal healthcare technology, smart sports‐technology, adaptive prosthetics and augmentation of human capability, etc.

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“…The major advantage of structures with stretchable interconnects over intrinsically stretchable composites is the strain‐independent conductivity, making them more reliable for signal input and output, though it supports smaller device density and requires sophisticated fabrication . To achieve better functionality and device density, Huang et al reported a framework to engineer 3D integrated stretchable electronics . This design adopted a layer‐by‐layer assembly of four device layers, with each elastomer layer transfer printed by 2D circuits with serpentine interconnects.…”

Section: Skin‐inspired Multifunctional Interfacesmentioning

confidence: 99%

Section: Skin‐inspired Multifunctional Interfacesmentioning

confidence: 99%

Bioinspired Prosthetic Interfaces

Ali

Cheng

et al. 2020

Adv Materials Technologies

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Mechanical replacement prosthetics have advanced in both esthetics and mechanical functions, but still require progress in attaining full natural functionality via tactile feedback. Through bioinspiration of the somatosensory system, recent works in the development of materials and technologies at three critical interfaces have shown great advancements: skin‐inspired multifunctionality at the prosthetic level using flexible electronics, artificial transmission of the biosignals between the prosthesis and nervous system, and stimulation and recording of these signals with mechanically compliant, implantable neural interfaces. Herein, a systematic study of the artificial skin sensation pathways for the prosthetic interfaces is discussed together with the current state‐of‐the‐art technologies and prospective strategies to enable the complete sensory feedback loop in prosthetics through the use of biomimetic sensing platforms, artificial synapses, and neural interrogation electronics.

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Three-dimensional integrated stretchable electronics

Cited by 427 publications

References 35 publications

Monolithic Integration of All‐in‐One Supercapacitor for 3D Electronics

Monolithic Integration of All‐in‐One Supercapacitor for 3D Electronics

Cyber–Physiochemical Interfaces

Bioinspired Prosthetic Interfaces

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