Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Wang, Jianhao; Xue, Songbai; Liu, Lu; Zhang, Peng; Nishikawa, Hiroshi

doi:10.1080/13621718.2022.2029102

Cited by 14 publications

(3 citation statements)

References 34 publications

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“…This top-view morphology fit with the scallop-like morphology in Figure 4a. During the aging process, the size of the Cu 6 Sn 5 grains increased, and hence the gaps were filled, making the top-view surface of the IMC layer flatter, which also fit with the cross-section morphology [13]. As the Cu 3 Sn is located between the Cu 6 Sn 5 and the Cu substrate, it cannot be observed from the top view.…”

Section: Evolution In Microstructure Of the Joint Interfacesupporting

confidence: 54%

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

Zhou

et al. 2022

Crystals

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With the continuous miniaturization and increase in functionality of the electronic devices used in the aerospace and national defense industries, the requirements for reliability of the solder joints in these devices keep increasing. In this study, a SnPbSb solder with excellent wettability was used as the research object, and the effects of high-temperature aging at 150 °C on the microstructure and mechanical properties of SnPbSb/Cu solder joints were investigated according to the relevant industry standards. It was found that high-temperature aging does not change the eutectic structure of the SnPbSb solder, but it does significantly coarsen the Sn-rich phase and the Pb-rich phase in the solder. In addition, the interfacial intermetallic compound (IMC) layer in the SnPbSb/Cu solder joint changes from a Cu6Sn5 single layer to a Cu6Sn5/Cu3Sn double layer after the aging, and the thickness of the IMC layer increases greatly. High-temperature aging significantly deteriorates the mechanical properties of the solder joints. After aging at 150 °C for 1000 h, the shear strength of the SnPbSb/Cu solder joints decreased by 45.39%, while the ductile fracture mode did not change.

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Section: Evolution In Microstructure Of the Joint Interfacesupporting

confidence: 54%

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

Zhou

et al. 2022

Crystals

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“…High current densities may result in significant Joule heating and temperature increases of over 250 °C in the dies of power devices . In most power-device manufacturing processes, dies are attached to substrates using Sn-based solders . However, because the melting point of Sn-based solders is low, such as the melting point of 217–219 °C of Sn-3.0Ag-0.5Cu solder, these solders tend to experience remelting and serious stability issues at high operating temperatures exceeding 250 °C. , Therefore, the development of die attachment materials that can endure high operating temperatures is in great demand.…”

Section: Introductionmentioning

confidence: 99%

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Wang,

Tatsumi,

et al. 2024

ACS Appl. Electron. Mater.

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Simplifying the bonding technique used to package power devices is crucial for electric vehicles and 5G communication. Herein, a transparent liquid Ag-based complex was employed to simplify the Ag sintering process. The complex can directly fabricate Ag nanostructures on substrates and dies by thermal decomposition at 180 °C for 30 min. These nanostructures consisted of linked nanoparticles with a wide size distribution and exhibited remarkable compressibility, indicating an excellent potential for sintering. Unlike traditional Ag paste, the Ag-based complex presented a single phase, and the obtained Ag nanostructures could be directly sintered at a low temperature. Robust sintered Ag joints with a high average shear strength of 45.4 MPa and a low porosity of 9.3% were successfully achieved by sintering at 300 °C and 5 MPa for 40 min. Such joint properties can be attributed to the frame−filler structure generated during sintering. This structure, which featured large Ag particles acting as frames and small Ag particles acting as bridges linking the frames, was beneficial for improving the sintering performance of the Ag nanostructures. The Ag-based complex could be used for the facile preparation of robust sintered Ag joints, creating possibilities for die attachment while reducing manufacturing costs.

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“…Then, a higher current density will be caused, thus leading to an increased heat production. Given different coefficients of thermal expansion (CTE) among multifunctional die, bonding materials and substrates, repeat switching operations would render cyclic internal thermal stress imposed to the bonding besides the existing restraint stress [11][12][13][14]. A significant solution was to alter the bonding material to make its CTE approach to those of chip and substrate [15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

Huang²,

et al. 2022

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Recently, 3D packaging has been regarded as an important technical means to continue Moore’s Law. However, excessive stacking will increase the longitudinal dimension, and one chip with high-density bondings packaging is still needed. Thus, it naturally places higher demand on thermal cycling reliability due to the decreased joint size to satisfy high-density packaging. In this work, the nano-Al2O3 (1 wt.%) modified Sn-1 wt.% Ag-0.5 wt.% Cu low-Ag solder was applied as a solder sample to evaluate the associated thermal cycling reliability. The investigated results revealed that the nano-Al2O3 modified solder did present enhanced thermal cycling reliability, as evidenced by the delayed microstructure coarsening and the inhibited atom inter-diffusion at interface caused by the adsorption of nano-Al2O3 on grain surfaces, and the resultant pinning effect. Worthy of note is that the potential of the newly developed nano-Al2O3 modified solder for high-density packaging applications (e.g., BGA, QFN, and CCGA) was evaluated based on the Finite Element Modeling.

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Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Cited by 14 publications

References 34 publications

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

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