2020
DOI: 10.1021/acsami.0c08260
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Three-Dimensional Printing of Ceramics through “Carving” a Gel and “Filling in” the Precursor Polymer

Abstract: Achieving a viable process for three-dimensional (3D) printing of ceramics is a sought-after goal in a wide range of fields including electronics and sensors for harsh environments, microelectromechanical devices, energy storage materials, and structural materials, among others. Low laser absorption of ceramic powders renders available additive manufacturing (AM) technologies for metals not suitable for ceramics. Polymer solutions that can be converted to ceramics (preceramic polymers) offer a unique opportuni… Show more

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Cited by 33 publications
(22 citation statements)
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“…It can effectively adjust the conductivity of semiconductor materials, and thus is extensively employed in conductors and semiconductor materials. In addition to the above characteristics, the content of boron in AlB12 is extremely high, reaching 82.8%, which is very promising as neutron shielding material [11][12][13].…”
Section: Introductionmentioning
confidence: 99%
“…It can effectively adjust the conductivity of semiconductor materials, and thus is extensively employed in conductors and semiconductor materials. In addition to the above characteristics, the content of boron in AlB12 is extremely high, reaching 82.8%, which is very promising as neutron shielding material [11][12][13].…”
Section: Introductionmentioning
confidence: 99%
“…1,2 Among various methods for AM of ceramics including photolithography, binder jetting, laser sintering, and free-form extrusion of ceramic particle-based slurries, [3][4][5][6][7][8] AM of polymer-derived ceramics 9 is notable, since in their polymer state they are suitable for printing, Honoring Dr. Mrityunjay Singh and the subsequent cross-linking maintains the printed geometry in a net shape. [10][11][12] Various methods such as lithography [13][14][15][16][17] and direct extrusion in the air or a yieldstress bath [18][19][20][21] have been used for AM of PDCs.…”
Section: Introductionmentioning
confidence: 99%
“…Metal borides are interstitial phase compounds, and their chemical bond composition is relatively complex (18,19). At the same time, they include one or more of MM metal bond, BB covalent bond and BM ionic bond.…”
Section: Introductionmentioning
confidence: 99%