Three-Dimensional Residue-Free Volume Removal inside Sapphire by High-Temperature Etching after<?layout cmd="newline"?> Irradiation of Femtosecond Laser Pulses

Matsuo, Shigeki; Tokumi, Kensuke; Tomita, Takuro; Hashimoto, Shuichi

doi:10.1155/2008/892721

Cited by 12 publications

(8 citation statements)

References 20 publications

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“…However, the SLE of crystals faces other problems: it is very hard to avoid cracks. Cracks are caused by modified crystalline material becoming amorphous and creating great volume tensions which lead to the crack of material [ 150 ]. Moreover, high selectivity comes from very low etching rates of unmodified material.…”

Section: Fabrication Of Functional 3d Structuresmentioning

confidence: 99%

3D Manufacturing of Glass Microstructures Using Femtosecond Laser

Butkutė

Jonušauskas

2021

Micromachines

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The rapid expansion of femtosecond (fs) laser technology brought previously unavailable capabilities to laser material processing. One of the areas which benefited the most due to these advances was the 3D processing of transparent dielectrics, namely glasses and crystals. This review is dedicated to overviewing the significant advances in the field. First, the underlying physical mechanism of material interaction with ultrashort pulses is discussed, highlighting how it can be exploited for volumetric, high-precision 3D processing. Next, three distinct transparent material modification types are introduced, fundamental differences between them are explained, possible applications are highlighted. It is shown that, due to the flexibility of fs pulse fabrication, an array of structures can be produced, starting with nanophotonic elements like integrated waveguides and photonic crystals, ending with a cm-scale microfluidic system with micro-precision integrated elements. Possible limitations to each processing regime as well as how these could be overcome are discussed. Further directions for the field development are highlighted, taking into account how it could synergize with other fs-laser-based manufacturing techniques.

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Section: Fabrication Of Functional 3d Structuresmentioning

confidence: 99%

3D Manufacturing of Glass Microstructures Using Femtosecond Laser

Butkutė

Jonušauskas

2021

Micromachines

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“…Recently, the ultrashort laser ablation of sapphire has been attracting much attention because ultrashort laser ablation can produce precise, well-defined micrometer-sized structures in materials that cannot be processed with nanosecond pulsed lasers. A number of studies on the ultrashort laser ablation of sapphire have been carried out [3][4][5][7][8][9], and a mechanism for the ultrashort laser ablation of sapphire has been proposed [4,5,7,[9][10][11]. In ultrashort laser ablation of sapphire, two ablation phases were observed.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond laser ablation of sapphire on different crystallographic facet planes by single and multiple laser pulses irradiation

Nishii

Yasui

et al. 2010

Optics and Lasers in Engineering

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“…This publication suggest inscribing nanogratings inside the sapphire volume and etching it with KOH. A similar procedure was demonstrated with HF acid [31]. The etching selectivity values of around 10000 [32] obtained.…”

Section: Introductionmentioning

confidence: 56%

Sapphire Selective Laser Etching Dependence on Radiation Wavelength and Etchant

Butkutė¹,

Sirutkaitis²,

Gailevičius³

et al. 2022

Preprint

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Transparent and high-hardness materials have become the object of wide interest. Most notably, it concerns technical glasses and crystals. A notable example is a sapphire – one of the most rigid materials having impressive mechanical stability and good optical properties. Nonetheless, using this material for 3D micro-fabrication is not straightforward due to its brittle nature. On the microscale, selective laser etching (SLE) technology is an appropriate approach for such media. Therefore, we present our research on c-cut crystalline sapphire microprocessing by using femtosecond radiation-induced SLE. Here we demonstrate a comparison between different wavelength radiation (1030 nm, 515 nm, 343 nm) usage for modification inscription and various etchants (Hydrofloridic acid, Sodium Hydroxide, Potassium Hydroxide and Sulphuric and Phosphoric acid mixture) comparison. We show that regular SLE etchants such as Hydrofluoric acid or Potassium Hydroxide are unsuitable materials for selective sapphire laser etching. Meanwhile, a 78% sulphuric and 22% phosphoric acid mixture at 270°C temperature is a good alternative for this process. We present the changes in the material after the separate processing steps. Finally, a protocol for advanced sapphire structure formation and a few exemplary structures are presented.

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Three-Dimensional Residue-Free Volume Removal inside Sapphire by High-Temperature Etching after Irradiation of Femtosecond Laser Pulses

Cited by 12 publications

References 20 publications

3D Manufacturing of Glass Microstructures Using Femtosecond Laser

3D Manufacturing of Glass Microstructures Using Femtosecond Laser

Femtosecond laser ablation of sapphire on different crystallographic facet planes by single and multiple laser pulses irradiation

Sapphire Selective Laser Etching Dependence on Radiation Wavelength and Etchant

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