Three-dimensional thermal analysis of rectangular micro-scale inorganic light-emitting diodes integrated with human skin

Cui, Yun; Li, Yuhang; Xing, Yufeng; Yang, Tianzhi; Song, Jizhou

doi:10.1016/j.ijthermalsci.2018.02.002

Cited by 27 publications

(15 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Cui et al [71] further extended the one-dimensional thermal model to a three-dimensional model to investigate the thermal properties of FIEDs involving a rectangular heating component (e.g., µ-ILED) integrated with human skin. The analytical model accounts for the coupling between the Fourier heat conduction in µ-ILED and the Pennes bio-heat transfer in skin.…”

Section: Thermal Analysis Of Fieds Integrated With Biological Tissuesmentioning

confidence: 99%

“…It is shown that a thicker substrate with a higher thermal conductivity can reduce the maximum temperature increase to avoid human discomfort or tissue injury. Cui et al [71] also investigated the thermal properties of FIED/skin system under a pulsed heat generation power to further reduce the temperature rise.…”

Section: Thermal Analysis Of Fieds Integrated With Biological Tissuesmentioning

confidence: 99%

“…to avoid human discomfort or tissue injury. Cui et al [71] also investigated the thermal properties of FIED/skin system under a pulsed heat generation power to further reduce the temperature rise. In order to consider the actual situations, the clothing effect [72], sweating effect [73], and interfacial thermal resistance effect [74] on thermal properties of the FIED/skin system were also investigated.…”

Section: Thermal Analysis Of Fieds Integrated With Biological Tissuesmentioning

confidence: 99%

“…(c) The comparison of temperature increase along the thickness direction between the analytical prediction and FEA[70]. (d) The three-dimensional analytical model showing a quarter geometry of the μ-ILED device integrated with skin tissue[71]. (e) The dependence of the thermal comfort map on the thickness and thermal conductivity of the substrate[71].…”

mentioning

confidence: 99%

See 3 more Smart Citations

Recent Advances on Thermal Management of Flexible Inorganic Electronics

Chen

Zhao³

et al. 2020

Micromachines

Self Cite

View full text Add to dashboard Cite

Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.

show abstract

Section: Thermal Analysis Of Fieds Integrated With Biological Tissuesmentioning

confidence: 99%

Section: Thermal Analysis Of Fieds Integrated With Biological Tissuesmentioning

confidence: 99%

Section: Thermal Analysis Of Fieds Integrated With Biological Tissuesmentioning

confidence: 99%

mentioning

confidence: 99%

See 2 more Smart Citations

Recent Advances on Thermal Management of Flexible Inorganic Electronics

Chen

Zhao³

et al. 2020

Micromachines

Self Cite

View full text Add to dashboard Cite

show abstract

“…Three-dimensional (3D) mesostructures with different geometrical topologies, feature sizes and material compositions have been intensively investigated in recent years [1][2][3], showing their promising potentials in various classes of micro/nanotechnologies, such as microelectromechanical systems [4,5], energy storage systems [6,7], biomedical devices [8,9], photonics and optoelectronics [10,11], micro-motors/robotics [12,13], flexible electronics [14][15][16][17] and many others. Diverse manufacturing techniques were developed for this purpose, including, for example, additive manufacturing [18][19][20], microcontact printing [21,22], volumetric optical exposures [23,24], self-rolling/folding induced by residual stresses [25,26] and mechanically guided 3D assembly [27][28][29][30][31].…”

Section: Introductionmentioning

confidence: 99%

Postbuckling analyses of frame mesostructures consisting of straight ribbons for mechanically guided three-dimensional assembly

Liu

Hwang

et al. 2019

Proc. R. Soc. A.

View full text Add to dashboard Cite

Mechanically guided assembly through buckling-induced two-dimensional (2D)-to- three-dimensional (3D) transformation represents a versatile approach to the formation of 3D mesostructures, thanks to the demonstrated applicability to a wide range of length scales (from tens of nanometres to centimetres) and material types (from semiconductors, metals to polymers and ceramics). In many demonstrated examples of device applications, the 2D precursor structures are composed of ribbon-type components, and some of them exhibit frame geometries consisting of multiple straight ribbons. The coupling of bending/twisting deformations among various ribbon components of the frame mesostructures makes the analyses more complicated than the case with a single component, which requires the development of a relevant theory to serve as the basis of design optimization in practical applications. Here, an analytic model of compressive buckling in such frame mesostructures is presented in the framework of energetic approach, taking into account the contributions of spatial bending deformations and twisting deformations. Three different frame geometries are studied, including ‘+’, ‘T' and ‘H' shaped designs. As validated by the experiments and finite-element analyses (FEA), the developed model can predict accurately the assembled 3D configurations during the postbuckling of different precursor shapes. Furthermore, the theoretical analyses provide approximate analytic solutions to some key physical quantities (e.g. the maximum out-of-plane displacements and maximum strains), which can be used as design references in practical applications.

show abstract

Inverse Design Strategies for 3D Surfaces Formed by Mechanically Guided Assembly

et al. 2020

View full text Add to dashboard Cite

Deterministic transformations of 2D patterns of materials into well‐controlled 3D mesostructures serve as the basis for manufacturing methods that can bypass limitations of conventional 3D micro/nanofabrication. Here, guided mechanical buckling processes provide access to a rich range of complex 3D mesostructures in high‐performance materials, from inorganic and organic semiconductors, metals and dielectrics, to ceramics and even 2D materials (e.g., graphene, MoS2). Previous studies demonstrate that iterative computational procedures can define design parameters for certain targeted 3D configurations, but without the ability to address complex shapes. A technical need is in efficient, generalized inverse design algorithms that directly yield sets of optimized parameters. Here, such schemes are introduced, where the distributions of thicknesses across arrays of separated or interconnected ribbons provide scalable routes to 3D surfaces with a broad range of targeted shapes. Specifically, discretizing desired shapes into 2D ribbon components allows for analytic solutions to the inverse design of centrally symmetric and even general surfaces, in an approximate manner. Combined theoretical, numerical, and experimental studies of ≈20 different 3D structures with characteristic sizes (e.g., ribbon width) ranging from ≈200 µm to ≈2 cm and with geometries that resemble hemispheres, fire balloons, flowers, concave lenses, saddle surfaces, waterdrops, and rodents, illustrate the essential ideas.

show abstract

Three-dimensional thermal analysis of rectangular micro-scale inorganic light-emitting diodes integrated with human skin

Cited by 27 publications

References 32 publications

Recent Advances on Thermal Management of Flexible Inorganic Electronics

Recent Advances on Thermal Management of Flexible Inorganic Electronics

Postbuckling analyses of frame mesostructures consisting of straight ribbons for mechanically guided three-dimensional assembly

Inverse Design Strategies for 3D Surfaces Formed by Mechanically Guided Assembly

Contact Info

Product

Resources

About