Three-Dimensional Wiring for Extensible Quantum Computing: The Quantum Socket

Béjanin, J. H.; McConkey, Thomas; Rinehart, J.R.; Earnest, C. T.; McRae, Corey Rae; Shiri, Daryoush; Bateman, James D.; Rohanizadegan, Y.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, Austin G.; Mariantoni, M.

doi:10.1103/physrevapplied.6.044010

Cited by 73 publications

(82 citation statements)

References 60 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Continued progress will require 3D integration and RF packaging techniques [1,2] that allow for scaling. Indeed, there are numerous developed technologies waiting to see fruitful implementation in the field of circuit-QED (cQED), both from room temperature microwave devices [3,4] and complex superconducting circuits [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit

et al. 2017

View full text Add to dashboard Cite

We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED (cQED) operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric field picture and a circuit model, and obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage cavity lifetime of 34.3 µs, corresponding to a quality factor of 2 million at single-photon energies. The transmon coherence times are T1 = 6.4 µs, and T Echo 2 = 11.7 µs. We measure qubit-cavity dispersive coupling with rate χqµ/2π = −1.17 MHz, constituting a Jaynes-Cummings system with an interaction strength g/2π = 49 MHz. With these parameters we are able to demonstrate cQED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.

show abstract

Section: Introductionmentioning

confidence: 99%

Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit

et al. 2017

View full text Add to dashboard Cite

show abstract

“…Heating due to ESR pulses can be mitigated by using cavities to confine the microwave modes [98,152,153], but this presents other challenges for bringing metal electrodes to the dots. Ongoing work in superconducting qubits for combining complex electromagnetic environments with sub-Kelvin temperatures makes us optimistic that engineering solutions are possible here as well [12,88,154,155].…”

Section: Discussionmentioning

confidence: 99%

Logical Qubit in a Linear Array of Semiconductor Quantum Dots

et al. 2018

View full text Add to dashboard Cite

We design a logical qubit consisting of a linear array of quantum dots, we analyze error correction for this linear architecture, and we propose a sequence of experiments to demonstrate components of the logical qubit on near-term devices. To avoid the difficulty of fully controlling a two-dimensional array of dots, we adapt spin control and error correction to a one-dimensional line of silicon quantum dots. Control speed and efficiency are maintained via a scheme in which electron spin states are controlled globally using broadband microwave pulses for magnetic resonance, while two-qubit gates are provided by local electrical control of the exchange interaction between neighboring dots. Error correction with two-, three-, and fourqubit codes is adapted to a linear chain of qubits with nearest-neighbor gates. We estimate an error correction threshold of 10 −4 . Furthermore, we describe a sequence of experiments to validate the methods on near-term devices starting from four coupled dots.

show abstract

“…To individually access every qubit in a 2D qubit array, standard multi-layer wiring technologies for silicon integrated circuits simply cannot be embraced as they generally require the introduction of decoherence enhancing and low-quality interlayer insulators [9,10]. Therefore, many groups have been forced to utilize non-monolithic bulky three-dimensional (3D) wiring technologies in current superconducting systems (see figure 1(a)), such as flip-chip bonding, pogo pins, and through-silicon vias (TSVs) [11][12][13][14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Pseudo-2D superconducting quantum computing circuit for the surface code: proposal and preliminary tests

et al. 2020

View full text Add to dashboard Cite

Among the major hardware platforms for large-scale quantum computing, one of the leading candidates is superconducting quantum circuits. Current proposed architectures for quantum error-correction with the promising surface code require a two-dimensional layout of superconducting qubits with nearest-neighbor interactions. A major hurdle for the scalability in such an architecture using superconducting systems is the so-called wiring problem, where qubits internal to a chipset become difficult to access by the external control/readout lines. In contrast to the existing approaches which address the problem through intricate three-dimensional wiring and packaging technology, leading to a significant engineering challenge, here we address this problem by presenting a modified microarchitecture in which all the wiring can be realized through a newly introduced pseudo two-dimensional resonator network which provides the inter-qubit connections via airbridges. Our proposal is completely compatible with current standard planar circuit technology. We carried out experiments to examine the feasibility of the new airbridge component. The measured quality factor of the airbridged resonator is below the simulated surface-code threshold required for a coupling resonator, and it should not limit simulated gate fidelity. The measured crosstalk between crossed resonators is at most −49 dB in resonance. Further spatial and frequency separation between the resonators should result in relatively limited crosstalk between them, which would not increase as the size of the chipset increases. This architecture and the preliminary tests indicate the possibility that a large-scale, fully error-corrected quantum computer could be constructed by monolithic integration technologies without additional overhead or special packaging know-how.

show abstract

Three-Dimensional Wiring for Extensible Quantum Computing: The Quantum Socket

Cited by 73 publications

References 60 publications

Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit

Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit

Logical Qubit in a Linear Array of Semiconductor Quantum Dots

Pseudo-2D superconducting quantum computing circuit for the surface code: proposal and preliminary tests

Contact Info

Product

Resources

About