Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects

Moore, Thomas; Vanderstraeten, Daniel; Forssell, Pirkko

doi:10.1109/tcapt.2002.1010010

Cited by 68 publications

(19 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…X-ray Microscopy System X-ray microscopy has been used for a wide variety of applications including defect inspection [14], biomedical imaging [15] and image security [16], to name a few. In [15] noise analysis of X-ray tomography is done for improved detection of nanoparticles in the brain, and in [16] an X-ray backscatter imager is used for explosive device detection.…”

Section: Counterfeit Ic Detectionmentioning

confidence: 99%

“…In [15] noise analysis of X-ray tomography is done for improved detection of nanoparticles in the brain, and in [16] an X-ray backscatter imager is used for explosive device detection. Non-destructive defect detection using X-rays has also been investigated in previous literature such as [14,17]. In X-ray lamininography the sample and detector are synchronized to rotate while 180° out of phase with one another during imaging, and has been used to detect defects in printed circuit boards [14].…”

Section: Counterfeit Ic Detectionmentioning

confidence: 99%

“…Non-destructive defect detection using X-rays has also been investigated in previous literature such as [14,17]. In X-ray lamininography the sample and detector are synchronized to rotate while 180° out of phase with one another during imaging, and has been used to detect defects in printed circuit boards [14]. In X-ray grating interferometry a phase grating, in addition to an absorption grating is used to provide an absorption image, differential phase image, and visibility contrast image of the sample.…”

Section: Counterfeit Ic Detectionmentioning

confidence: 99%

See 2 more Smart Citations

Real-time automated counterfeit integrated circuit detection using x-ray microscopy

et al. 2015

View full text Add to dashboard Cite

Received Month X, XXXX; revised Month X, XXXX; accepted Month X, XXXX; posted Month X, XXXX (Doc. ID XXXXX); published Month X, XXXX Determining the authenticity of integrated circuits is paramount in preventing counterfeit and malicious hardware from being used in critical military, healthcare, aerospace, consumer, and industry applications. Existing techniques to distinguish between authentic and counterfeit integrated circuits often includes destructive testing requiring subject matter experts. We present a non-destructive technique to detect counterfeit integrated circuits using X-ray microscopy and advanced imaging analysis with different pattern recognition approaches. Our proposed method is completely automated, and runs in real time. In our approach, images of an integrated circuit are obtained from an X-ray microscope. Local binary pattern features are then extracted from the X-ray image followed by dimensionality reduction through principal component analysis, and alternatively through a non-linear principal component methodology using a stacked autoencoder embedded in a deep neural network. From the reduced dimension features, we train two types of learning machines, a support vector machine with a non-linear kernel, and a deep neural network. We present experiments using authentic and counterfeit integrated circuits to demonstrate that the proposed approach achieves an accuracy of 100% in distinguishing between the counterfeit and authentic samples.

show abstract

Section: Counterfeit Ic Detectionmentioning

confidence: 99%

Section: Counterfeit Ic Detectionmentioning

confidence: 99%

Section: Counterfeit Ic Detectionmentioning

confidence: 99%

See 1 more Smart Citation

Real-time automated counterfeit integrated circuit detection using x-ray microscopy

et al. 2015

View full text Add to dashboard Cite

show abstract

“…For X-ray inspection, the internal material has distinctly different levels of absorbency of X-rays [8]. Thus, the variance in the shape and thickness of a solder joint can be revealed by the X-ray images [9]. SAM can illuminate optically opaque materials, providing depth-specific information and locally evaluating mechanical properties [10].…”

Section: Introductionmentioning

confidence: 99%

Defect detection of flip-chip solder joints using modal analysis

Liu¹,

Shi²,

Wang³

et al. 2012

Microelectronics Reliability

View full text Add to dashboard Cite

“…Since it was used in 1970s, much work has been done about CL on the scanning trajectories, reconstruction algorithms and image processing methods [11][12][13][14]. The imaging speed and the image quality have been improved greatly.…”

Section: Introductionmentioning

confidence: 99%

Large field of view computed laminography with the asymmetric rotational scanning geometry

Jiang²,

Li³

2010

Sci. China Technol. Sci.

View full text Add to dashboard Cite

X-ray computed laminography (CL) is used in the fields of industrial inspection and medical imaging. It can provide the internal structure three-dimensional (3D) information of a region of the objects nondestructively. It is important to the clinical diagnosis and the quality control of flat objects like printed circuit boards, aircraft wings and satellite solar panels. With the restriction that the imaging region must be within the X-ray beam formed by the X-ray source and the detector, the imaging field of view of CL is limited by the size of detector. A new CL method with an asymmetric rotational cone-beam scanning geometry, called large field of view CL, is presented to overcome the existing disadvantage. It can extend the imaging region when the imaging spatial resolution keeps the same as that of the conventional CL. It can also improve the imaging spatial resolution when the imaging region keeps the same as that of the conventional CL. The asymmetric configuration can be achieved by offsetting the detector from the conventional symmetric configuration. It does not, however, require new detectors and X-ray source nor alter the scanning mechanical system. The filtered back-projection (FBP) reconstruction algorithm and the data truncation smoothing functions have been deduced to reconstruct the images directly from the data acquired with this asymmetric configuration. We performed numerical studies and experiments to demonstrate and validate the proposed approach. Results in these studies and experiments confirm that the proposed method can enlarge the imaging region and improve the spatial resolution. The proposed approach may find applications in the CL system with the rotational scanning geometry. computed laminography, image reconstruction, reconstruction algorithm, imaging field of view, imaging spatial resolution Citation:Fu J, Jiang B H, Li B. Large field of view computed laminography with the asymmetric rotational scanning geometry.

show abstract

Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects

Cited by 68 publications

References 10 publications

Real-time automated counterfeit integrated circuit detection using x-ray microscopy

Real-time automated counterfeit integrated circuit detection using x-ray microscopy

Defect detection of flip-chip solder joints using modal analysis

Large field of view computed laminography with the asymmetric rotational scanning geometry

Contact Info

Product

Resources

About