2019 IEEE International Electron Devices Meeting (IEDM) 2019
DOI: 10.1109/iedm19573.2019.8993553
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Three-layer Stacked Color Image Sensor With 2.0-μm Pixel Size Using Organic Photoconductive Film

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Cited by 9 publications
(7 citation statements)
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“…In addition, indium–tin–zinc–oxide (ITZO) was used as a high-mobility active channel material for the TFTs to accommodate a smaller pixel size of 20 μm and a higher number of pixels of 320 × 240 (QVGA). The color video imaging operation of the sensor was confirmed, and spectral crosstalk lower than those of the previous three-layer-stacked sensors mentioned in refs and was achieved, especially in the R-light region, through the integration of the CIS and two color-selective OPFs.…”
Section: Introductionsupporting
confidence: 56%
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“…In addition, indium–tin–zinc–oxide (ITZO) was used as a high-mobility active channel material for the TFTs to accommodate a smaller pixel size of 20 μm and a higher number of pixels of 320 × 240 (QVGA). The color video imaging operation of the sensor was confirmed, and spectral crosstalk lower than those of the previous three-layer-stacked sensors mentioned in refs and was achieved, especially in the R-light region, through the integration of the CIS and two color-selective OPFs.…”
Section: Introductionsupporting
confidence: 56%
“…Comparing this work with ref , the responses of the G and B channels at 650 nm were markedly reduced from 0.87 and 0.25 to 0.08 and <0.02, respectively. In addition, the response of the B channel was also markedly reduced from 0.44 mentioned in ref to <0.02. At 550 nm, the responses of the R and B channels in this work (0.016 and <0.02, respectively) were lower than those mentioned in ref (both 0.44).…”
Section: Results and Discussionmentioning
confidence: 78%
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“…With the miniaturization of the sensors in recent years, the pixel size has been significantly decreased to afford a high-resolution image. However, it still remains challenging to decrease the pixel size to less than 1 μm while maintaining high sensitivity because of a decrease in the amount of photons. ,, To overcome this limitation, three-dimensional (3D) vertically stacked structures without color filters have been proposed, as the entire spectrum of visible light possibly absorbs without loss. Among these, the stacked structures employing wavelength-selective organic photodiodes (OPDs) have been studied as promising alternatives to the conventional Si-based image sensors because of their color constancy, as the Si-based 3D-stacked structures exhibit degraded spectral characteristics. Based on this approach, the research studies successfully enhanced the spectral response and sensitivity without a loss of the active area. We previously described organic-on-Si hybrid CMOS color image sensors, which comprised a vacuum-deposited green-light-selective OPD built onto a CMOS circuit containing a Si photodiode with R and B color filters. Significant results including the well-balanced RGB spectra, low dark current (DC), high photoconversion efficiency, and decreased crosstalk between the pixels were achieved.…”
Section: Introductionmentioning
confidence: 99%