High-quality ZrB 2 thin films have been deposited at substrate temperatures as low as 300°C by a new method: remote hydrogen-plasma chemical vapor deposition from the single-source precursor Zr(BH 4) 4. Carrying out the deposition in the presence of atomic hydrogen generates films with properties that are far superior to those deposited by purely thermal methods; the latter are boron-rich, oxidize readily in air, and adhere poorly to the substrates. In contrast, the films generated at a substrate temperature of 300°C in the presence of atomic H have a B/Zr ratio of 2, a resistivity of 40 ⍀ cm, an oxygen content of р4 at. %, and are fully conformal in deep vias. A 20 nm thick amorphous film of ZrB 2 on c-Si͑001͒ prevents Cu indiffusion after 30 min at 750°C. We propose that the beneficial effects of atomic hydrogen can be attributed to promoting the desorption of diborane from the growth surface.