Time-independent elastic–plastic behaviour of solder materials

Effects of different drop test conditions on board-level reliability of chip-scale packages

“…The massweighted and stiffness-weighted dampings of the test vehicle were assumed to be 0.063 and 0.02, respectively. All components were linearly elastic except for the solder alloy, for which a trilinear elastoplastic stress-strain relationship [21], as depicted in Fig. 10, was prescribed.…”

The effect of downscaling the dimensions of solder interconnects on their creep properties

“…The microstructure is characterized by a few b-Sn-dendrites that are surrounded by a relatively large area of the quasieutectic, that consists small intermetallic particles that are finely dispersed into the b-Sn-matrix. In addition, the microstructure may contain a small number of primary Ag 3 Sn-and Cu 6 Sn 5 -phases [4,24]. In contrast to the bulk microstructure the SnAg 3.5 flip chip joints (Fig.…”

An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

“…Since the accuracy of FEA affects the strength reliability of electronic equipment, many studies have attempted to conduct FEA with high precision by reflecting the deformation characteristics of solder alloys accurately. [1][2][3][4] Meanwhile, Cu/Sn intermetallic compound (IMC) layers of Cu 3 Sn and Cu 6 Sn 5 are generated at the interface between solder and copper wiring during soldering processes. Since Cu/Sn IMCs are considered to be brittle, fatigue cracking is likely to occur at the IMCs layer when solder joints are subjected to cyclic deformation.…”