2019
DOI: 10.1299/jsmetokai.2019.68.113
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Time of resolved X-ray analysis in Self-propagating exothermic reaction of Al/Ni multilayer films

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Cited by 3 publications
(3 citation statements)
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“…As is known that a mixing layer, considered as a diffused layer, exists at the interface between Al and Ni layers with a constant thickness regardless of bilayer thickness. 32) Assuming that the atomic ratio of Al and Ni does not change and the mixing layer is not included, the heat generation is kept constant, regardless of bilayer thickness. However, the mixing layer, which heat generation is much lower than the heat of NiAl formation, is definitely formed between Al and Ni layers.…”
Section: Methodsmentioning
confidence: 99%
“…As is known that a mixing layer, considered as a diffused layer, exists at the interface between Al and Ni layers with a constant thickness regardless of bilayer thickness. 32) Assuming that the atomic ratio of Al and Ni does not change and the mixing layer is not included, the heat generation is kept constant, regardless of bilayer thickness. However, the mixing layer, which heat generation is much lower than the heat of NiAl formation, is definitely formed between Al and Ni layers.…”
Section: Methodsmentioning
confidence: 99%
“…[19][20][21][22][23] Therefore, for Ni and Al to react at a one-to-one atomic ratio, the Al/Ni multilayer material is usually fabricated by alternately depositing Al and Ni using a physical vapor deposition (PVD) method at every few nanometers of thickness for MEMS and Si devices. 8,14,24) However, the size of the fabricated substrate is limited by the size of the vacuum chamber used in the PVD method. This can cause a decline in both productivity and convenience for other engineering applications.…”
Section: Introductionmentioning
confidence: 99%
“…Several papers on the fabrication of Al/Ni multilayer films by the PVD method have been published in the literature. 22,25) However, the quality of the surface of silicon substrates may detrimentally be affected by the PVD process. Moreover, the size of the fabricated substrate is limited by the size of the vacuum chamber used in the PVD method.…”
Section: Introductionmentioning
confidence: 99%