Tin Coatings Electrodeposited from Sulfonic Acid-Based Electrolytes: Tribological Behavior

Bengoa, Leandro Nicolás; Tuckart, Walter Roberto; Zabala, Nicolás Ariel; Prieto, Germán; Egli, Walter Alfredo

doi:10.1007/s11665-015-1503-4

Cited by 12 publications

(7 citation statements)

References 31 publications

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“…Generally, alkaline electrolytes in the form of sodium or potassium stannate make it possible to obtain relatively compact deposits, but high temperatures and stability of the tetravalent state are required. The acidic electrolytes in the main form of tin(II) sulphate, sulphonate or fluoroborate assure hydrolytic stability and improve conductivity, but tin whiskers are formed without any additives owing to extremely small electrochemical reaction overpotential and the rapid reduction reaction rate of Sn 2+ . Specifically, considering the economic disadvantages of alkali stannate or sulphuric acid – cresylic phenylic sulphonic acid baths, Kekesi et al proposed the application of HCl‐SnCl 2 solutions for tin electrorefining .…”

Section: Introductionmentioning

confidence: 99%

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Lei

Yang

2016

J of Chemical Tech & Biotech

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BACKGROUND A new membrane electro‐deposition based process for tin recovery from stannous solid waste was introduced. Linear sweep voltammetry (LSV), cyclic voltammetry (CV) and chronoamperometry (CHR) was applied to investigate the electrodeposition of tin(II) from a stannous chloride acid electrolyte containing an amine non‐ionic surfactant by using a membrane cell. RESULTS Electrochemical mechanism analysis results showed that 0.3% vol. amine non‐ionic surfactant facilitated ions diffusion by increasing the diffusion coefficient from 8.32E‐12 m2 s−1 to 2.85E‐11 m2 s−1, and inhibited tin(II) ions reduction as well as tin nucleation and hydrogen evolution. The applied ionic membrane did not hinder tin electrodeposition, while tin(II) ions reduction and hydrogen evolution was weakened with increasing HCl concentration from 1.5 to 4.5 mol L−1 and Sn2+ concentration increased from 20 to 80 g L−1. CONCLUSIONS The tin(II) reduction process is proved to be irreversible and diffusion‐controlled, while the nucleation and growth of tin was involved in the process of diffusion for the proton reduction occuring in parallel with tin electrodeposition, and the process follows the mechanism of three‐dimensional instantaneous nucleation and subsequent grain growth limited by diffusion. © 2016 Society of Chemical Industry

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Section: Introductionmentioning

confidence: 99%

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Lei

Yang

2016

J of Chemical Tech & Biotech

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“…All patterns are provided in Figure S1 (on ceramics) and Figure S2 (on silicon), supplementary material. The relative texture coefficient (RTC) of the respective (hkl) orientation was calculated from the intensity of the measured curves using Equation (1) [31,32]:…”

Section: Experimental Design Statistical Method and Test Realizationmentioning

confidence: 99%

Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates

et al. 2018

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This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilayer ceramic substrates. The variation of sputter parameters in a wide range following a fractional factorial experimental design generates diverse crystallographic properties of the layers. Crystal growth, composition, and stress are distinguished because of substrate morphology and thermal conditions. The best c-axis orientation of aluminum nitride emerges on ceramic substrates at a heater temperature of 150 • C and sputter power of 400 W. Layers deposited on ceramic show stronger c-axis texture than those deposited on silicon due to higher surface temperature. The nucleation differs significantly dependent on the substrate. It is demonstrated that a ceramic substrate material with an adapted coefficient of thermal expansion to aluminum nitride allows reducing the layer stress considerably, independent on process temperature. Layers sputtered on silicon partly peeled off, while they adhere well on ceramic without crack formation. Direct deposition on ceramic enables thus the development of optimized layers, avoiding restrictions by stress compensating needs affecting functional properties.

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“…The effect of the citrate ions in the MSA electrolyte appears to be rather diverse. It is known, that citrate ions in the MSA electrolyte form several types of complexes with Sn(II) ions [24,25]. This might indicate the formation of relatively stable citrate complexes that lead to an increase in the polarization at the higher potentials for the deposition reaction of the active tin species (Figure 7).…”

Section: Electrochemical Characterizationmentioning

confidence: 96%

Alkoxylated β-Naphthol as an Additive for Tin Plating from Chloride and Methane Sulfonic Acid Electrolytes

Zajkoska

Mulone

Hansal³

et al. 2018

Coatings

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β-naphthol was one of the first additives introduced for smooth and homogeneous tin electrodeposition. Although it can be oxidized under the plating conditions, forming either 1,2-napthoquinone or polymeric materials based on naphthioxides, it is still in use. In this work, an investigation of its more stable form, alkoxylated β-naphthol (ABN), on tin plating is undertaken. For this purpose, chloride based (pH~5) and methane sulfonic acid (MSA, pH~0.5) electrolytes, including ABN, were prepared. Reaction kinetics were studied by polarization, Tafel measurements, and cyclic voltammetry. Tin electrodeposits were obtained on flat brass substrates. Surface morphology and preferred crystal orientation were studied by Scanning Electron Microscopy (SEM) and X-ray Diffraction (XRD). In both studied electrolytes ABN acts as an inhibitor but in the case of the chloride electrolyte it is more pronounced. In the MSA electrolyte this effect was overlaid by the presence of tin-citrate complexes. In the chloride-based electrolyte, ABN has a grain refining effect, while in the MSA electrolyte an increase of ABN concentration leads to a slight enlargement of the average grain size. X-ray analysis shows a constant decrease of the (101) intensity with increasing concentration of ABN for the sample deposited from both baths.

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Tin Coatings Electrodeposited from Sulfonic Acid-Based Electrolytes: Tribological Behavior

Cited by 12 publications

References 31 publications

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Electrochemical mechanism of tin membrane electro‐deposition in chloride solutions

Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates

Alkoxylated β-Naphthol as an Additive for Tin Plating from Chloride and Methane Sulfonic Acid Electrolytes

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