Tin (IV) Chloride Solution as a Sensitizer in Photoselective Metal Deposition

Abstract

Experiments were conducted which show that Sn(IV) bound to a substrate is capable, in conjunction with Pd(II), of catalyzing Ni-P plating and that this effect can be inhibited by u.v. light. Some of the parameters affecting the quality of the plating and u.v. inhibition were determined. It was also found that in order for u.v. irradiation to inhibit Ni-P plating, the radiation must be applied after the Pd(lI) activation step. In the case of copper, however, plating occurs only on the irradiated area of the catalyst. A mixture of Sn(IV) and Pd(II) was also found to catalyze Ni-P plating. The behavior of the catalyst deposited by this mixture was quite similar to that of the catalyst present after Pd(II) activation following Sn(IV) sensitization in the stepwise procedure. * Electrochemical Society Active 1VIember. ExperimentalAll chemicals were supplied by Fisher or Canlab, A.C.S. reagent grade, and were used without further purification.) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP Vol. I23, No. 3 ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP

Microstructure evolution during electroless copper deposition

“…The sensitization and activation process by double immersion in SnClj and PdClj solutions has been studied [1][2][3] and one-step activation in PdClj-SnClj colloid solution followed by acceleration (HCl or NH4HF2 and others) was also investigated [4][5][6][7][8]. In contrast to the detailed chemical analyses presented in these researches [1][2][3][4][5][6][7][8], we studied the activation process through microstructure analysis by scanning transmission electron microscopy (STEM). This method provides information on sizes and distributions as well as chemical composition of the catalytic particles.…”

Interactions of Electroless Catalysts with Plasma‐Oxidized Surfaces of Polystyrene‐Based Resins

“…There are a number of techniques that use electroless deposition for applying metal patterns onto polymeric substrates (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11). Sharp (1), Chow et al (5), Schlesinger et al (6,7), and Baylis et al (8)(9)(10)(11) examined methods by which the electroless catalysts were photochemically activated (9) or deactivated (5). Their work led to examinations (12) of the effect of oxidized substrates on the activity of electroless catalysts.…”

Proton Backscattering Analysis of the Pd Catalyst on Glass Used in Electroless Deposition

“…As noted earlier, we have shown that u.v. light can be utilized either as an inhibitor or as a stimulator for electroless plating (1). Thus, for instance, using a suitably aged Sn +4 sensitizing solution Cu plating will not be initiated unless the catalyst layer has been ex- posed to u.v.…”

“…Any discussion of this paper will appear in a Discussion Section to be published in the June 1980 JOURNAL. AI1 discussions for the June 1980 Discussion Section should be submitted by Feb. 1,1980.…”

“…Ultraviolet light has a marked effect on the catalyzed surface [see Ref. (1) and references therein]. It proved possible with Sn(IV) as tl~e sensitizer to achieve a positive image (using Ni-P) or a negative image (using Cu) of the photomask.…”