Experiments were conducted which show that Sn(IV) bound to a substrate is capable, in conjunction with Pd(II), of catalyzing Ni-P plating and that this effect can be inhibited by u.v. light. Some of the parameters affecting the quality of the plating and u.v. inhibition were determined. It was also found that in order for u.v. irradiation to inhibit Ni-P plating, the radiation must be applied after the Pd(lI) activation step. In the case of copper, however, plating occurs only on the irradiated area of the catalyst. A mixture of Sn(IV) and Pd(II) was also found to catalyze Ni-P plating. The behavior of the catalyst deposited by this mixture was quite similar to that of the catalyst present after Pd(II) activation following Sn(IV) sensitization in the stepwise procedure. * Electrochemical Society Active 1VIember. ExperimentalAll chemicals were supplied by Fisher or Canlab, A.C.S. reagent grade, and were used without further purification.) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP Vol. I23, No. 3 ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.218.248.209 Downloaded on 2015-04-06 to IP

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Es wird durch Experimente gezeigt, daß Sensibilisierung durch eine saure Sn(IV)‐ Lösung gefolgt von Aktivierung durch eine Pd(II)‐Lösung die Ni‐P‐Plattierung katalysiert (nicht aber die Cu‐Plattierung) und daß UV‐Bestrahlung diesen Effekt inhibiert.