Abstract:Abstract. Nowadays, chip multiprocessors (CMPs) are the new standard design for a wide range of microprocessors: mobile devices (in the near future almost every smartphone will be governed by a CMP), desktop computers, laptop, servers, GPUs, APUs, etc. This new way of increasing performance by exploiting parallelism has two major drawbacks: off-chip bandwidth and communication latency between cores. 3D die-stacked processors are a recent design trend aimed at overcoming these drawbacks by stacking multiple dev… Show more
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