1996
DOI: 10.1117/1.600782
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Tolerance analysis for three‐dimensional optoelectronic systems packaging

Abstract: A series of optoelectronic processing systems is under development at the Optoelectronic Computing System Center (OCSC) at the University of Colorado. The demonstrations consist of two facing optoelectronic modules that communicate with each other using bidirectional free-space optical channels. An analysis of the fabrication tolerances required for correct operation of these systems is presented. An overview of the system and the techniques used for fabrication is given, along with the tolerances achieved in … Show more

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Cited by 15 publications
(4 citation statements)
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“…The substrate is held in a computer controlled translation stage, and the chip is held in a chuck, which is attached to the ultrasonic transducer. The translation stage is used to move the substrate into position under the chip, and bonding takes place [6].…”
Section: System Assembly 41 Flip-chip Bonding Of the Vcsel Array Andmentioning
confidence: 99%
“…The substrate is held in a computer controlled translation stage, and the chip is held in a chuck, which is attached to the ultrasonic transducer. The translation stage is used to move the substrate into position under the chip, and bonding takes place [6].…”
Section: System Assembly 41 Flip-chip Bonding Of the Vcsel Array Andmentioning
confidence: 99%
“…There have been a number of studies on FSOI systems, its alignment, tolerancing, and packaging. [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] In the present study, we approached the problem from a statistical point of view that was focused on the development of a probabilistic relationship between the system performance and tolerance variables in the form of a prediction equation. Such an equation could then serve as the basis for the design, evaluation, and optimization of the FSOI system.…”
Section: Introductionmentioning
confidence: 99%
“…However, alignment between the optical source and detector is critical for high-performance, reliable optical interconnect applications, and mechanical noises due to vibration and temperature variation inside the computer systems have prevented the wide deployment of such technology. Optical misalignment introduces higher insertion loss and crosstalk between optical links, which can severely impact the system performance and reliability [5,6].…”
mentioning
confidence: 99%