Topography of Solid Surfaces Modified by Fast Ion Bombardment

Ghose, D.; Karmohapatro, S.B.

doi:10.1016/s0065-2539(08)60598-3

Cited by 15 publications

(5 citation statements)

References 217 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Furthermore, ion bombardment causes surface micro-roughening and the formation of various micro-sized surface features (Figure 9). Cones, pyramids, pits, hillocks, steps, etc., have been observed, and their formation is closely related to the initial surface irregularities, impurities, intrinsic or ion-beam-induced defects and variations in the sputtering yield as a function of the angle of ion beam incidence to the surface [25,26]. Especially large topographic changes occur at high fluencies of ions.…”

Section: Substrate Irregularities Induced By Ion Etchingmentioning

confidence: 99%

Surface Topography of PVD Hard Coatings

et al. 2021

View full text Add to dashboard Cite

The primary objective of this study was to investigate and compare the surface topography of hard coatings deposited by three different physical vapor deposition methods (PVD): low-voltage electron beam evaporation, unbalanced magnetron sputtering and cathodic arc evaporation. In these deposition systems, various ion etching techniques were applied for substrate cleaning. The paper summarizes our experience and the expertise gained during many years of development of PVD hard coatings for the protection of tools and machine components. Surface topography was investigated using scanning electron microscopy (SEM), atomic force microscopy (AFM), scanning transmission electron microscopy (STEM) and 3D stylus profilometry. Observed similarities and differences among samples deposited by various deposition methods are discussed and correlated with substrate material selection, substrate pretreatment and deposition conditions. Large variations in the surface topography were observed between selected deposition techniques, both after ion etching and deposition processes. The main features and implications of surface cleaning by ion etching are discussed and the physical phenomena involved in this process are reviewed. During a given deposition run as well as from one run to another, a large spatial variation of etching rates was observed due to the difference in substrate geometry and batching configurations. Variations related to the specific substrate rotation (i.e., temporal variations in the etching and deposition) were also observed. The etching efficiency can be explained by the influence of different process parameters, such as substrate-to-source orientation and distance, shadowing and electric field effects. The surface roughness of PVD coatings mainly originates from growth defects (droplets, nodular defects, pinholes, craters, etc.). We briefly describe the causes of their formation.

show abstract

Section: Substrate Irregularities Induced By Ion Etchingmentioning

confidence: 99%

Surface Topography of PVD Hard Coatings

et al. 2021

View full text Add to dashboard Cite

show abstract

“…The little discrepancy can be explained mainly by the surface roughness -facilitating the ejection of particles -which is not taken into account in the present simulation. In fact, it is well known that under ion beam bombardment leading to sputtering, the scanning electron micrographs of the irradiated samples revealed various modifications in the surfaces such as craters of typical size 10 µm with intertwined ripples [19,20]. Furthermore, all the distribution curves exhibited an over-cosine tendency, with a fit parameter n = 1.6 for aluminum ( Fig.…”

Section: Mathematical Formalismmentioning

confidence: 93%

Angular Distribution of Sputtered Particles from Ternary Alloy Fe_71.9Cr_5.6Al_22.5 under Kr⁺ Bombardment at Normal Incidence

et al. 2019

View full text Add to dashboard Cite

Iron, chromium and aluminum particles sputtered under 5 keV by Kr + ion bombardment at normal incidence from the ternary alloy Fe82Cr6Al12 was simulated. The Stopping and Range of Ions in Matter (SRIM) software combined to a new code-program, called Angulaire, were used to obtain the sputtering yields and angular distributions of the ejected species. The simulation was performed for a large number of incident ions (about 2 × 10 5 ions) and the number of particles emitted in the solid angle corresponding to the probe was counted by a computer. The angular distributions of sputtered particles were compared with the results available in the literature and showed a reasonable agreement. Furthermore, we have demonstrated that the angular distribution of the differential sputtering yields of all ejected species (iron, aluminum, and chromium) from the ternary alloy exhibited an over-cosine tendency.

show abstract

“…According to first-order erosion theory, the dependence of sputtering yield on angle of incidence of the ion beam plays a major role in formation of sputtered cones, as suggested by different authors (Carter et al 1983;Ghose and Karmohapatro 1990). If 0 be the angle between the direction of the incident ion beam and the normal to the surface, then the sputtering yield Y(O) follows a sec0 dependence when 0 is low.…”

Section: Possible Mechanism Of Cone Formation On the Samplementioning

confidence: 99%

“…This variation of Y(O) with 0 is shown in figure 2. A number of authors have discussed the mechanism of cone formation as summarized by Ghose and Karmohapatro (1990) in their recent review of the subject. The following mechanism for the nucleation of cones can be regarded as responsible in our present investigation.…”

Section: Possible Mechanism Of Cone Formation On the Samplementioning

confidence: 99%

Cone formation on Ag surface bombarded by Ar at oblique incidence

1995

View full text Add to dashboard Cite

Sputter-induced topographical modifications of a silver surface bombarded by mass-analysed ions of 30keV 4°Ar ÷ obtained from an electromagnetic isotope separator incident at an angle of 58 ° was studied. Analysis of the silver surface by scanning electron microscopy showed that most of the bombarded area was covered with features similar to corrugated terrace steps, sharp and fine cones, and pyramids. The underlying mechanism for formation of such features is discussed. The method of formation of such sharp cones produced by ion bombardment will increasingly find applications in the formation of fine tips required in scanning probe and field emission microscopy.

show abstract

Topography of Solid Surfaces Modified by Fast Ion Bombardment

Cited by 15 publications

References 217 publications

Surface Topography of PVD Hard Coatings

Surface Topography of PVD Hard Coatings

Angular Distribution of Sputtered Particles from Ternary Alloy Fe_71.9Cr_5.6Al_22.5 under Kr⁺ Bombardment at Normal Incidence

Cone formation on Ag surface bombarded by Ar at oblique incidence

Contact Info

Product

Resources

About

Topography of Solid Surfaces Modified by Fast Ion Bombardment

Cited by 15 publications

References 217 publications

Surface Topography of PVD Hard Coatings

Surface Topography of PVD Hard Coatings

Angular Distribution of Sputtered Particles from Ternary Alloy Fe71.9Cr5.6Al22.5 under Kr+ Bombardment at Normal Incidence

Cone formation on Ag surface bombarded by Ar at oblique incidence

Contact Info

Product

Resources

About

Angular Distribution of Sputtered Particles from Ternary Alloy Fe_71.9Cr_5.6Al_22.5 under Kr⁺ Bombardment at Normal Incidence