High-throughput screening
of mechanical properties can transform
materials science research by both aiding in materials discovery and
developing predictive models. However, only a few such assays have
been reported, requiring custom or expensive equipment, while the
mounting demand for enormous data sets of materials properties for
predictive models is unfulfilled by the current characterization throughput.
We address this problem by developing a high-throughput colorimetric
adhesion screening method using a common laboratory centrifuge, multiwell
plates, and microparticles. The technique uses centrifugation to apply
a homogeneous mechanical detachment force across individual formulations
in a multiwell plate. We also develop a high-throughput sample deposition
method to prepare films with uniform thickness in each well, minimizing
well-to-well variability. After establishing excellent agreement with
the well-known probe tack adhesion test, we demonstrate the consistency
of our method by performing the test on a multiwell plate with two
different formulations in an easily discernible pattern. The throughput
is limited only by the number of wells in the plates, easily reaching
10
3
samples/run. With its simplicity, low cost, and large
dynamic range, this high-throughput method has the potential to change
the landscape of adhesive material characterization.