Toughening of epoxy resin with amine functional aniline acetaldehyde condensate

Abstract

The diglycidyl ether of bisphenol‐A (DGEBA) resin was modified with amine functional aniline acetaldehyde condensate (AFAAC) and cured with an ambient temperature curing agent triethylene tetramine. The resulting networks displayed significantly improved fracture toughness. The AFAAC was synthesized by the condensation reaction of aniline and acetaldehyde in the acid medium (pH 4) and characterized by FTIR and NMR spectroscopy, elemental analysis, viscosity measurements, and mole of primary and secondary amine analysis. The DGEBA and AFAAC were molecularly miscible but developed a two‐phase microstructure upon network formation. Epoxy/AFAAC compositions were systematically varied to study the effect of AFAAC concentration on the impact, adhesive, tensile, and flexural properties of modified networks. The dynamic mechanical analysis and scanning electron microscopy studies showed two phase morphology in the cured networks, where AFAAC particles were dispersed. The AFAAC modified epoxy network was thermally stable up to around 280°C. POLYM. ENG. SCI., 47:1695–1702, 2007. © 2007 Society of Plastics Engineers

Application of box‐behnken design and neural computation for tribo‐mechanical performance analysis of iron‐mud‐filled glass‐fiber/epoxy composite and parametric optimization using PSO

“…Present composite was fabricated using Epoxyl‐56L (Chemical Name‐Bisphenol‐A‐Diglycidyl‐Ether) as matrix material having an elastic modulus of 3.42 GPa and density of 1,190 kg/m 3 which can be cured at room temperature. Epoxy is used because of its high rigidity and superior wear and thermal properties, satisfactory corrosion resistance to alkali and acid and less volumetric shrinkage during curing exhibiting excellent dimensional stability in the electronic and coating industries .…”

Disecondary amine synthesis and its reaction kinetics with epoxy prepolymers

“…Kinetic parameters, activation energy of epoxy‐amine reaction of DGEBA‐based epoxy prepolymer and N,N ′‐diethyl‐3,3′‐diaminodiphenyl sulfone, were calculated without any assumption on conversion‐dependency. In this respect, Kissinger's equation26, 27 can be used as where β is heating rate, A is pre‐exponential factor, R is universal gas constant, E K is activation energy of the reaction, and T P is peak temperature at which the reaction rate is maximum. The plot of −ln(β/ T P 2 ) versus 1/ T P generates a straight line from the slope of which activation energy, E K and from the intercept pre‐exponential factor, A can be calculated.…”

Dynamic DSC curing kinetic study of epoxy resin of 1,3‐bis(4‐hydroxyphenyl) prop‐2‐en‐1‐one using aromatic diamines and phthalic anhydride

“…The steric restrictions to the epoxy-amine addition reaction, physical interactions among different functional groups of the constituent components, and curing extension can also influence the curing kinetics. [14][15][16][17][18][19] The curing reaction is a complex process because many reactions sometime take place simultaneously. The final properties of the cross-linked resins depend significantly on the kinetics of the curing reaction concerned with the extent of curing, the curing conditions, etc.…”

“…The use of modified aromatic diamines and aromatic diamines containing heterocyclic rings are reported in the literature for the improvement of thermal resistance of epoxy resins. [14][15][16][17][18] Curing kinetics of thermosets is very useful in understanding structure/property/processing relationships for manufacture and utilization of these polymeric materials. Differential scanning calorimetry (DSC) is an important tool for understanding curing kinetics of thermosetting materials, in predicting shelf-life and optimizing processing conditions.…”