Towards a 3D conceptual architecture framework, based on multi-physical constraints

Topological approach for assessment of electromagnetic interferences to support mechatronic conceptual design

“…Indeed, as multiphysical phenomena are highly dependent on the physical 3D architecture, and as design costs are mainly committed in the first design phases [12,13], it is necessary to be able to evaluate 3D architecture alternatives under multi-physical constraints from the conceptual design phase. In parallel, Model-Based Systems Engineering (MBSE) efficiently supports the multidisciplinary approach required by the design of such systems [14][15][16]. Thus, our research work focuses on the extension of the SAMOS (Spatial Architecture based on Multi-physics and Organization of Systems) MBSE approach [17], developed by R. Barbedienne for thermal constraints [18], to the EM constraints [15].…”

“…In parallel, Model-Based Systems Engineering (MBSE) efficiently supports the multidisciplinary approach required by the design of such systems [14][15][16]. Thus, our research work focuses on the extension of the SAMOS (Spatial Architecture based on Multi-physics and Organization of Systems) MBSE approach [17], developed by R. Barbedienne for thermal constraints [18], to the EM constraints [15]. SAMOS supports the evaluation of 3D physical architecture under multi-physical constraints during the conceptual design phase.…”

“…The SAMOS framework supports the evaluation of 3D architecture under multiphysical constraints, during the conceptual design phase [15]. As the 3D positioning between E/E interacting components impacts EMC system performances, a 3D architecture has to be assessed as early as possible in order to verify that the chosen positioning of components meets the predefined EM requirements.…”

EMC risk assessment process through a topological analysis

“…Therefore, the evaluation of such a physical architecture of concept under multi-physical constraints is required as of the early design stage, in order to reduce the design time and cost. Our research focuses on extending the Barbedienne et al developed SAMOS approach [8] for the thermal constraints [9] to the EMC issues [10]. This Model-Based System Engineering (MBSE) approach has been implemented in a 3D Multi-physical Sketcher framework.…”