Towards Embedded Cooling - Gen 3 Thermal Packaging Technology

Bar‐Cohen, Avram

doi:10.1142/9789814579797_0016

Cited by 8 publications

(4 citation statements)

References 26 publications

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“…Thus, the heat dissipation of audio systems using GaN devices will be one of the following research focuses. The TMT (Thermal Management Technologies) program introduces several cooling technologies of heat management in semiconductors, such as attached cooling and embedded cooling technologies [82][83][84]. The junction temperature of the GaN devices is usually generated at the drain side of the gate, and for this reason, the thermal management solutions should focus on the heat area.…”

Section: Thermal Conductivitymentioning

confidence: 99%

The Class D Audio Power Amplifier: A Review

Mei

Hu²,

Xu³

et al. 2022

Electronics

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Class D power amplifiers, one of the most critical devices for application in sound systems, face severe challenges due to the increasing requirement of smartphones, digital television, digital sound, and other terminals. The audio power amplifier has developed from a transistor amplifier to a field-effect tube amplifier, and digital amplifiers have made significant progress in circuit technology, components, and ideological understanding. The stumbling blocks for a successful power amplifier are low power efficiency and a high distortion rate. Therefore, Class D audio amplifiers are becoming necessary for smartphones and terminals due to their power efficiency. However, the switching nature and intrinsic worst linearity of Class D amplifiers compared to linear amplifiers make it hard to dominate the market for high-quality speakers. The breakthrough arrived with the GaN device, which is appropriate for fast-switching and high-power-density power electronics switching elements compared with traditional Si devices, thus, reducing power electronic systems’ weight, power consumption, and cost. GaN devices allow Class D audio amplifiers to have high fidelity and efficiency. This paper analyzes and discusses the topological structure and characteristics and makes a judgment that Class D amplifiers based on GaN amplifiers are the future development direction of audio amplifiers.

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Section: Thermal Conductivitymentioning

confidence: 99%

The Class D Audio Power Amplifier: A Review

Mei

Hu²,

Xu³

et al. 2022

Electronics

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“…Only data for which all orientations showed two-phase flow were considered and non-linear data near CHF were excluded. The average variation in two-phase HTC between the best and worst orientations decreased considerably as the mass flux increased from 100 kg/m 2 At the lowest mass flux of 100 kg/m 2 -s, the HTCs in the VD orientation are much lower than those in the other orientations. In this orientation and mass flux, the centerline of the channel is largely devoid of liquid and most of the two-phase flow occurs near the channel sides, as shown in Figure 6.…”

Section: Heat Transfer Coefficients and Flow Regimesmentioning

confidence: 90%

Orientation Effects in Two-Phase Microgap Flow

Robinson

Bar‐Cohen

2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystem

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The high power density of emerging electronic devices is driving the transition from remote cooling, which relies on conduction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for other applications (e.g., spacecraft and aircraft). The lack of acceptable models and correlations for orientation-and gravityindependent operation has limited the use of two-phase coolers in such applications. Previous research has revealed that gravitational acceleration plays a diminishing role in establishing flow regimes and transport rates as the channel size shrinks, but there is considerable variation among the proposed microscale criteria and limited research on two-phase flows in low aspect ratio microgap channels. Reliable criteria for achieving orientation-and gravity-independent flow boiling would enable emerging systems to exploit this thermal management technique and streamline the technology development process.As a first step toward understanding the effect of gravity on two-phase microgap flow and transport, in the present effort the authors have studied the effect of evaporator orientation and mass flux on near-saturated flow boiling of HFE7100 in a 1.01 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. Orientation-independence, defined as achieving similar critical heat fluxes, heat transfer coefficients, and flow regimes across evaporator orientations, was achieved for mass fluxes of 400 kg/m 2 -s and greater. The present results are compared to published criteria for achieving gravity-independence.

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“…The confluence of chip power dissipation above 100 W, localized hot spots with fluxes above 1 kW/cm 2 , and package-level volumetric heat generation that can exceed 1 kW/cm 3 has exposed the limitations of the current "remote cooling" paradigm and its inability to support continued enhancements in the performance of advanced silicon and compound semiconductor components. These thermal limitations have compromised the decades-long Moore's law progression in microprocessor performance and threaten to derail the innovation engine which has been responsible for much of the microelectronic revolution [1,2].…”

Section: State-of-the-art In Embedded Coolingmentioning

confidence: 99%

Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow

Bar‐Cohen

Robinson

Deisenroth

2018

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present "remote cooling" paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/cm 2 , but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), twophase cooling in intra-and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year "inward migration" of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with "remote" or attached air-and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from singlephase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior. Keywords-embedded cooling; electronics cooling; two-phase flow; heat transfer; microgap; microchannelRecent studies [27][28][29][30][31][32][33] of two-phase thermofluid behavior in relatively long (100 < / < 500) microgap channels have uncovered a strong dependence of the previously observed Mshape variation in heat transfer coefficient, as seen in Fig. 4, on the prevailing two-phase flow regimes. The low-quality peak in

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Towards Embedded Cooling - Gen 3 Thermal Packaging Technology

Cited by 8 publications

References 26 publications

The Class D Audio Power Amplifier: A Review

The Class D Audio Power Amplifier: A Review

Orientation Effects in Two-Phase Microgap Flow

Challenges and opportunities in Gen3 embedded cooling with high-quality microgap flow

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