Toxicological Investigations in the Semiconductor Industry: I. Studies on the Acute Oral Toxicity of a Complex Mixture of Waste Products from the Aluminium Plasma Etching Process

Abstract

In dry etching processes--one of the sources of potential exposure to toxic wastes in the semiconductor industry--complex mixtures of inorganic and organic compounds arise from reactions between feed stock gases (BCl3/Cl2), top layers (aluminium photoresist), and the carrier gas (N2). Two different fractions of the complex mixture--one an ethanolic solution (ES) and the other an insoluble liquid residue (LR)--were examined for acute oral toxicity in rats. Analytical data showed that the ethanol soluble fraction contained mainly inorganic compounds, whereas the residue contained various halogenated hydrocarbons. Neither death nor behavioral changes occurred after oral administration and observation up to 23 days. ES caused a lower mean arterial blood pressure in both sexes, increased P-R-intervals in male rats, and caused some mild biochemical and hematological alterations and changes in relative organ weights compared to the control groups. Exposure to LR influenced food and water intake, and caused a significant decrease in body weights, signs of polyurie, as well as changes in various relative organ weights and biochemical and hematological parameters. The blood pressure of the male animals fell and the heart rates of both sexes decreased.

Effect of occupational safety measures on micronucleus frequency in semiconductor workers

“…A typical source of complex chemical exposure is wastes in the semiconductor industry. These wastes are potentially toxic mixtures of inorganic and organic compounds originating from the plasma etching process during semiconductor production (Muller et al 2002;Bauer et al 1992). The process involves gases that are transformed into a highly energetic state and broken into radicals and ions using high process temperatures of 700-800°C and high-frequency stimulation.…”

Predicting Low Toxicity and Scalable Solvent Systems for High‐Speed Roll‐to‐Roll Perovskite Manufacturing

“…[3] The ink solvents, as the majority component of inks, have the largest potential for health impact during the perovskite film processing, directing us to focus the present study to identifying less-toxic solvent compositions. Indeed, toxic chemicals and solvents have been readily used in industrial semiconductor processing with well-known negative health effects, [19][20][21][22][23] so we will use the present study to generalize the perovskite ink solvent selection framework, quantifying the effects of toxicity in perovskite thin-film manufacturing processes. We develop a set of selection rules that leads us to formulate a less toxic, fast crystalizing perovskite ink for use in slot die coating applications.…”

Predicting Low Toxicity and Scalable Solvent Systems for High‐Speed Roll‐to‐Roll Perovskite Manufacturing

“…[ 3 ] The ink solvents, as the majority component of inks, have the largest potential for health impact during the perovskite film processing, directing us to focus the present study to identifying less‐toxic solvent compositions. Indeed, toxic chemicals and solvents have been readily used in industrial semiconductor processing with well‐known negative health effects, [ 19–23 ] so we will use the present study to generalize the perovskite ink solvent selection framework, quantifying the effects of toxicity in perovskite thin‐film manufacturing processes. We develop a set of selection rules that leads us to formulate a less toxic, fast crystalizing perovskite ink for use in slot die coating applications.…”