“…Note: The deposition rate can vary slightly for different ALD machines or as a precursor is used and the vapor pressure decreases. The total number of cycles ( Figure 3 D), the deposition temperature, and the precursors can be modified to achieve the desired conductivity of the material, see Huddy et al. (2022) .…”
Section: Step-by-step Methods Detailsmentioning
confidence: 99%
“… Figure 4 Metal electrode deposition and imaging of 3D-printed mesostructures (A–D) 3D-printed mesostructured (A) masked for electrode deposition, (B) in the gold sputterer, (C) masked after electrode deposition, and (D) unmasked after electrode deposition. (E–G) SEM images of 3D-printed mesostructures with scale bars of 1 mm (E and F) and 100 μm (G), reproduced with permission from Huddy et al (2022) . SEM images show samples masked with thinner channels to emphasize contrast between sputtered and non-sputtered regions.…”
Section: Step-by-step Methods Detailsmentioning
confidence: 99%
“…Without this seed layer, ALD growth of conducting/semiconducting materials is inhibited on photopolymer materials. This process can be expanded to other photopolymer materials and ALD oxide coatings beyond those employed here (including structures printed with other 3D printers, see Huddy et al., 2022 for details), allowing conversion of AM mesostructures into devices with potential applications in energy storage, sensing, and microrobotics.…”
Section: Before You Beginmentioning
confidence: 99%
“…This can be applied to ultrasmooth, customizable photopolymer lattices printed by high-resolution microstereolithography. For complete details on the use and execution of this protocol, please refer to Huddy et al. (2022) .…”
mentioning
confidence: 99%
“…For complete details on the use and execution of this protocol, please refer to Huddy et al. (2022) .…”
“…Note: The deposition rate can vary slightly for different ALD machines or as a precursor is used and the vapor pressure decreases. The total number of cycles ( Figure 3 D), the deposition temperature, and the precursors can be modified to achieve the desired conductivity of the material, see Huddy et al. (2022) .…”
Section: Step-by-step Methods Detailsmentioning
confidence: 99%
“… Figure 4 Metal electrode deposition and imaging of 3D-printed mesostructures (A–D) 3D-printed mesostructured (A) masked for electrode deposition, (B) in the gold sputterer, (C) masked after electrode deposition, and (D) unmasked after electrode deposition. (E–G) SEM images of 3D-printed mesostructures with scale bars of 1 mm (E and F) and 100 μm (G), reproduced with permission from Huddy et al (2022) . SEM images show samples masked with thinner channels to emphasize contrast between sputtered and non-sputtered regions.…”
Section: Step-by-step Methods Detailsmentioning
confidence: 99%
“…Without this seed layer, ALD growth of conducting/semiconducting materials is inhibited on photopolymer materials. This process can be expanded to other photopolymer materials and ALD oxide coatings beyond those employed here (including structures printed with other 3D printers, see Huddy et al., 2022 for details), allowing conversion of AM mesostructures into devices with potential applications in energy storage, sensing, and microrobotics.…”
Section: Before You Beginmentioning
confidence: 99%
“…This can be applied to ultrasmooth, customizable photopolymer lattices printed by high-resolution microstereolithography. For complete details on the use and execution of this protocol, please refer to Huddy et al. (2022) .…”
mentioning
confidence: 99%
“…For complete details on the use and execution of this protocol, please refer to Huddy et al. (2022) .…”
Metastructure‐based pressure sensors (MBPS) offer higher sensitivity, broader sensing range, greater design flexibility, and superior performance tunability compared with traditional pressure sensors. Currently, there exists a gap between metastructure architecture design and prediction of sensing performance. To this end, a new design‐to‐manufacturing paradigm is presented. A coupled mechanical‐electrical finite element model is developed to predict sensing performance of systematically designed MBPS. Rapid prototyping by additive manufacturing (AM) is achieved via micro‐digital light processing (μDLP) and atomic layer deposition (ALD) for forming nanoscale conductive coatings. Results indicate that a large sensing range requires high metastructure stiffness, achieved by increasing relative density. However, high sensitivity and reversible sensing range both rely on elastic coating deformation – enforcing a balance between these properties. The trade‐off between sensing range and sensitivity is investigated for structures with different Poisson’s ratios and fillet ratios. Metastructure architecture design can lead to substantial expansion of the sensing range, enabling pressure detection ranging from 0 to 15 MPa (6.23% strain). An impressive sensitivity variance of 6.8 times has been observed between the highest and lowest MBPS samples. Finally, we demonstrate how our design framework allows deep electromechanical integration of 3D printed sensors with additively manufactured components, such as a truss bridge.This article is protected by copyright. All rights reserved.
Abstract2D metal oxides (2DMOs) have recently emerged as a high‐performance class of ultrathin, wide bandgap materials offering exceptional electrical and optical properties for a wide area of device applications in energy, sensing, and display technologies. Liquid metal printing represents a thermodynamically advantageous strategy for synthesizing 2DMOs by a solvent‐free and vacuum‐free scalable method. Here, recent progress in the field of liquid metal printed 2D oxides is reviewed, considering how the physics of Cabrera‐Mott oxidation gives this rapid, low‐temperature process advantages over alternatives such as sol‐gel and nanoparticle processing. The growth, composition, and crystallinity of a burgeoning set of 1–3 nm thick liquid metal printed semiconducting, conducting, and dielectric oxides are analyzed that are uniquely suited for the fabrication of high‐performance flexible electronics. The advantages and limitations of these strategies are considered, highlighting opportunities to amplify the impact of 2DMO through large‐area printing, the design of doped metal alloys, stacking of 2DMO to electrostatically engineer new oxide heterostructures, and implementation of 2D oxide devices for gas sensing, photodetection, and neuromorphic computing.
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