Transient evolution of the target erosion profile during magnetron sputtering: Dependence on gas pressure and magnetic configuration

Nakano, Takeo; Saitou, Y.; Oya, Kei

doi:10.1016/j.surfcoat.2016.12.053

Cited by 12 publications

(7 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The ion current density is peaked at the radius where the magnetic field is tangent to the cathode surface (Wendt et al 1988). This leads to the formation of a characteristic erosion groove in the target surface, referred to as the race track (Chapin 1974, Nakano et al 2017. The erosion groove determines the target utilization, the target lifetime and the efficiency of the material usage.…”

Section: The Planar Magnetron Configurationmentioning

confidence: 99%

Physics and technology of magnetron sputtering discharges

Guðmundsson

2020

Plasma Sources Sci. Technol.

354

219

View full text Add to dashboard Cite

Magnetron sputtering deposition has become the most widely used technique for deposition of both metallic and compound thin films and is utilized in numerous industrial applications. There has been a continuous development of the magnetron sputtering technology to improve target utilization, increase ionization of the sputtered species, increase deposition rates, and to minimize electrical instabilities such as arcs, as well as to reduce operating cost. The development from the direct current (dc) diode sputter tool to the magnetron sputtering discharge is discussed as well as the various magnetron sputtering discharge configurations. The magnetron sputtering discharge is either operated as a dc or radio frequency discharge, or it is driven by some other periodic waveforms depending on the application. This includes reactive magnetron sputtering which exhibits hysteresis and is often operated with an asymmetric bipolar mid-frequency pulsed waveform. Due to target poisoning the reactive sputter process is inherently unstable and exhibits a strongly non-linear response to variations in operating parameters. Ionized physical vapor deposition was initially achieved by adding a secondary discharge between the cathode target and the substrate and later by applying high power pulses to the cathode target. An overview is given of the operating parameters, the discharge properties and the plasma parameters including particle densities, discharge current composition, electron and ion energy distributions, deposition rate, and ionized flux fraction. The discharge maintenance is discussed including the electron heating processes, the creation and role of secondary electrons and Ohmic heating, and the sputter processes. Furthermore, the role and appearance of instabilities in the discharge operation is discussed.

show abstract

Section: The Planar Magnetron Configurationmentioning

confidence: 99%

Physics and technology of magnetron sputtering discharges

Guðmundsson

2020

Plasma Sources Sci. Technol.

354

219

View full text Add to dashboard Cite

show abstract

“…The ions originate from this non-uniform plasma region and bombard the target, and the ion current density is peaked and maximum ion bombardment occurs over the region where the magnetic field is tangential to the cathode surface (Wendt 1988, Wendt et al 1988. Therefore, a characteristic erosion groove forms in the target surface, referred to as the racetrack (Chapin 1974, Nakano et al 2017. The erosion groove determines the target utilization, the target lifetime, and the efficiency of the material usage and is therefore a major drawback of the planar magnetron arrangement in comparison to dc diode sputtering.…”

Section: Magnetron Sputtering Discharge Configurationsmentioning

confidence: 99%

Foundations of physical vapor deposition with plasma assistance

Guðmundsson

Anders

Keudell

2022

Plasma Sources Sci. Technol.

View full text Add to dashboard Cite

Physical vapor deposition (PVD) refers to the removal of atoms from a solid or a liquid by physical means, followed by deposition of those atoms on a nearby surface to form a thin film or coating. Various approaches and techniques are applied to release the atoms including thermal evaporation, electron beam evaporation, ion-driven sputtering, laser ablation, and cathodic arc-based emission. Some of the approaches are based on a plasma discharge, while in other cases the atoms composing the vapor are ionized either due to the release of the film-forming species or they are ionized intentionally afterwards. Here, a brief overview of the various PVD techniques is given, while the emphasis is on sputtering, which is dominated by magnetron sputtering, the most widely used technique for deposition of both metallic and compound thin films. The advantages and drawbacks of the various techniques are discussed and compared.

show abstract

“…We performed exploratory depositions using two fixed parameters and three variable parameters. The fixed parameters were pressure at the process chamber of 1.1 mTorr, and a DC power of 100 W. Meanwhile, the initial values of the variable parameters were proposed in the following way: deposition time, 20 s; distance from magnetron to the substrate, 5 cm; and substrate position in the deposition plane, matching the substrate geometric center with the point of greatest erosion in the toroid produced by the ionic roughing from the magnetron, see Figure 2 [27]. This last value is 10 mm from the substrate edge to the substrate-holder geometric center as shown in Figure 3.…”

Section: Determination Of Deposition Parametersmentioning

confidence: 99%

Simple Fabrication and Characterization of an Aluminum Nanoparticle Monolayer with Well-Defined Plasmonic Resonances in the Far Ultraviolet

Aguilar-Del-Valle

Cruz‐Manjarrez

Rodríguez-Gómez

2018

Metals

View full text Add to dashboard Cite

Currently, aluminum plasmonics face technical challenges for the manufacture of reproducible structures by simple and low-cost techniques. In this work, we used a direct current (DC) sputtering system to grow a set of quasi-spherical aluminum nanoparticles with diameters below 10 nm. Our particles are uniformly distributed over the surface of quartz and nitrocellulose substrates. We review in detail the methodology for the determination of adequate deposition parameters to allow great reproducibility in different production runs. Likewise, we carry out an exhaustive nanostructural characterization by means of scanning and transmission electron microscopy. The latter allowed us to identify that our depositions are nanoparticle monolayers with thicknesses equal to the average particle diameter. Finally, by means of absorbance spectra we identify the presence of a very well-defined plasmonic resonance at 186 nm that is associated with the dipolar mode in particles smaller than 10 nm. Due to the sharpness of their plasmonic resonances as well as their great manufacturing simplicity and high reproducibility, our aluminum nanoparticles could be used as optical sensors.

show abstract

Transient evolution of the target erosion profile during magnetron sputtering: Dependence on gas pressure and magnetic configuration

Cited by 12 publications

References 36 publications

Physics and technology of magnetron sputtering discharges

Physics and technology of magnetron sputtering discharges

Foundations of physical vapor deposition with plasma assistance

Simple Fabrication and Characterization of an Aluminum Nanoparticle Monolayer with Well-Defined Plasmonic Resonances in the Far Ultraviolet

Contact Info

Product

Resources

About