Transient Liquid Phase Diffusion Bonding of 6061Al-15 wt.% SiC p Composite Using Mixed Cu-Ag Powder Interlayer

Roy, Pallab; Pal, Tapan Kumar; Maity, Joydeep

doi:10.1007/s11665-016-2165-6

Cited by 7 publications

(3 citation statements)

References 32 publications

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“…In the case of a lower 50 wt%, the base metal powders completely melted, and also in the case 60 wt% and higher, the base metal powders partially melted and remained in the vicinity of the bonded interlayer. Roy et al 31 studied bonding of a 6061Al-15 wt.% SiC extruded composite using a 50-µm thick mixed Cu-Ag powder interlayer. In their experiments, 2 h were necessary for completion of isothermal solidification.…”

Section: Introductionmentioning

confidence: 99%

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

Zaheri

Farahani

Sadeghi

et al. 2021

Proceedings of the Institution of Mechanical Engineers, Part B:

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The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologies and microstructures were studied by scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. First, to explore the optimum bonding time and temperature, nine samples were bonded without interlayers in a vacuum condition. Mechanical test results indicated that bonding at 560°C in 20 min returns the highest bond strength (84% of Al). This bonding condition was used to join ten samples with powder interlayers. Powders were prepared by mixing different combinations of Cu, Al (+Fe nanoparticles) and Zn. In the bonding zone, different Cu9Al4, CuAl, and CuAl2 intermetallic co-precipitate. The strongest bonding is formed in the sample with the 70Al (+Fe)-30Cu powder interlayer. Powder interlayers present thinner and more uniform intermetallic layers at the joint interface.

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Section: Introductionmentioning

confidence: 99%

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

Zaheri

Farahani

Sadeghi

et al. 2021

Proceedings of the Institution of Mechanical Engineers, Part B:

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show abstract

“…Liu [15] et al welded Al-Si alloy by friction stir welding, and a fine Al-Si eutectic structure was formed in the joint. The transient liquid phase (TLP) brazing method has been successfully used for joining Albased composite materials [16,17], and its application on Al-Si alloys was also investigated. Wang et al [18][19][20][21] completed the joining of Al-Si alloy by transient liquid phase brazing under ultrasonic induction with Zn-based solder and Sn-51In solder.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Behavior and Shear Strength of Al-25Si-4Cu-1Mg Joints by Transient Liquid Phase Bonding with Cu as Interlayer

Gao

Wang

2021

Metals

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Spray-formed hypereutectic Al-Si-Cu-Mg alloy is the candidate for automotive and aerospace industries due to its superior wear resistance, lower thermal expansion coefficient and density, and higher thermal conductivity. This paper aims to investigate the bonding properties of hypereutectic Al-25Si-4Cu-1Mg alloys using the transient liquid phase (TLP) method with Cu as an interlayer. To obtain the suitable bonding parameters, the interfacial microstructure and shear strength of Al-25Si-4Cu-1Mg joints were investigated with the effect of different bonding temperatures and holding times. The results showed that TLP bonding between Al-Si-Mg-Cu alloy was mainly realized by large amounts of Al2Cu intermetallic compounds (IMCs), primary Si and α-Al phases. With the brazing temperature increasing, the width of the brazing seam gradually increased, and the voids began to be produced. With the holding time increasing, θ-Al2Cu phases approached into the base metal and Si particles in the brazing seam were obviously coarsened. With the formation of θ-Al2Cu phases into the base metal, more Si particles were segregated at the interface between brazing seam and base metal, and the shear test confirmed that it was the weakest bonding location. Finally, the effect of bonding parameters on the joint strength indicated that the joint brazed at 540 °C for 7.5 min presented the best shear performance with the shear strength reaching 75 MPa because the size of Si particles in the brazing seam was closest to the size of Si particles in base metal under this parameter.

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“…Aluminum matrix composites (AMCs) reinforced with particulates have a combination of superior properties, e.g., light weight, high stiffness, high wear resistance and high specific strength. Numerous methods have been utilized to manufacture particle reinforced AMCs, for instance, diffusion bonding 1,2 , compo-casting 3,4 and powder metallurgy 5,6 . Powder metallurgy is especially applicable because its processing temperature is relatively low and particle reinforcements can be uniformly dispersed.…”

Section: Introductionmentioning

confidence: 99%

Solution Treatment Behaviors of 6061 Aluminum Alloy Prepared by Powder Thixoforming

Zhang

Chen

2018

Mat. Res.

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Powder thixoforming (PTF) was a promising processing technology that can be used to fabricate high strength particle reinforced aluminum matrix composites, and a pioneer 6061 matrix alloy was fabricated utilizing PTF to investigate its solution treatment behaviors. A comparison study with traditional permanent mold cast (PMC) 6061 alloy disclosed that PTF alloy showed significantly reduced pore amount with only 0.16% (3.50% for PMC alloy). During solution treatment, PTF alloy displayed a much quicker solutionization progress than PMC alloy because of coarse eutectic phases and primary dendrites in latter alloy, its peak values of 14.5%, 241 MPa and 195 MPa in elongation, ultimate tensile strength and yield strength were achieved at 560ºC, an enhancement of 81.3%, 33.9% and 97.0%, respectively, compared with as-fabricated alloy. The dissolution of eutectic phases plays a dominative role in the growth of the primary α phases and secondarily primary α phases within 535ºC. However, the coarsening after 535ºC is subject to a mixture model involving atom diffusion along grain boundaries and through the crystal lattice. The superior tensile strengths of PTF alloy than PMC alloy resulted from decreased grain size, enhanced solid solution strengthening, reduced porosities and decreased harmful effect of insoluble phases in PTF alloy.

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Transient Liquid Phase Diffusion Bonding of 6061Al-15 wt.% SiC p Composite Using Mixed Cu-Ag Powder Interlayer

Cited by 7 publications

References 32 publications

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

Interfacial Behavior and Shear Strength of Al-25Si-4Cu-1Mg Joints by Transient Liquid Phase Bonding with Cu as Interlayer

Solution Treatment Behaviors of 6061 Aluminum Alloy Prepared by Powder Thixoforming

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