Transient liquid phase sintered attach for power electronics

Greve, Hannes; Chen, Liang‐Yu; Fox, Ian M.; McCluskey, F. Patrick

doi:10.1109/ectc.2013.6575608

Cited by 25 publications

(9 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Plating assisted TLP Plated balls Cu-Sn Sn plated Cu, pressure less [57] Thermal gradient TLP IMC layer Cu-Sn IMC layer [58] Solder paste TLP Paste Cu-Sn Solder paste [59] Sintering assisted TLP Residue Cu-Sn Sn-residue [60] Sintering assisted TLP Activated paste Cu-Sn Formic acid-solder paste [61] The melting point inhibitors such as Ag, Cu, or Ni in Sn do not have high diffusivity in solid base Cu, and it takes a longer time for isothermal solidification. The major Sn-based solder systems include Sn-3.5Ag, Sn-0.7Cu, and Sn-3.0Ag-0.5Cu.…”

Section: Bonding Timementioning

confidence: 99%

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

View full text Add to dashboard Cite

Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

show abstract

Section: Bonding Timementioning

confidence: 99%

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

View full text Add to dashboard Cite

show abstract

“…Liquid phase diffusion bonding reactions in the Sn-Cu-Ni system were examined by McCluskey, Greve, and Moeini with a Sn-3.5Ag LTP in combination with Cu, Ni, or mixture of Cu and Ni powders with Ni substrates as the HTP substrates [67,68,72] . Samples were processed at a peak temperature of 300°C in an inert atmosphere for approximately 30 minutes using 0. as the HTP and up to 600 °C (test setup limit) with Ni HTP particles [73] .…”

Section: Liquid Phase Diffusion Bonding In the Cu-ni-sn Systemmentioning

confidence: 99%

Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

Choquette¹

2018

View full text Add to dashboard Cite

“…[67,68,72] Samples were processed at a peak temperature of 300°C in an inert atmosphere for approximately 30 minutes using 0.2 MPa of applied pressure to reduce void formation. The resulting microstructures for NiSn and (Cu, Ni)-Sn contained few voids; pockets of Sn in cross-sections of the bonds indicated incomplete solidification.…”

Section: Liquid Phase Diffusion Bonding In the Cu-ni-sn Systemmentioning

confidence: 99%

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Reeve

Holaday

Choquette

et al. 2016

J. Phase Equilib. Diffus.

View full text Add to dashboard Cite

New electronics applications demanding enhanced performance and higher operating temperatures have led to continued research in the field of Pb-free solder designs and interconnect solutions. In this paper, recent advances in the microstructural design of Pb-free solders and interconnect systems were discussed by highlighting two topics: increasing b-Sn nucleation in Snbased solders, and isothermally solidified interconnects using transient liquid phases. Issues in bSn nucleation in Sn-based solders were summarized in the context of Swenson's 2007 review of the topic. Recent advancements in the areas of alloy composition manipulation, nucleating heterogeneities, and rapid solidification were discussed, and a proposal based on a multi-faceted solidification approach involving the promotion of constitutional undercooling and nucleating heterogeneities was outlined for future research. The second half of the paper analyzed two different approaches to liquid phase diffusion bonding as a replacement for high-Pb solders, one based on the application of the pseudo-binary Cu-Ni-Sn ternary system, and the other on a proposed thermodynamic framework for identifying potential ternary alloys for liquid phase diffusion bonding. All of the concepts reviewed relied upon the fundamentals of thermodynamics, kinetics, and solidification, to which Jack Smith substantially contributed during his scientific career.

show abstract

Transient liquid phase sintered attach for power electronics

Cited by 25 publications

References 11 publications

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Liquid-phase diffusion bonding and the development of a Cu-Ni/Sn composite solder paste for high temperature lead-free electrical connections

Advances in Pb-free Solder Microstructure Control and Interconnect Design

Contact Info

Product

Resources

About