Transient liquid phase (tlp) diffusion bonding of Ti45Ni49Cu6 P/M components using Cu interlayer

Kejanlı, Haluk; Taşkın, Mustafa; Kolukisa, Sedat; Topuz, Polat

doi:10.1007/s00170-008-1860-3

Cited by 17 publications

(9 citation statements)

References 7 publications

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“…The bonding process is usually confined in a vacuum [3-5, 7, 12, 14-17, 20-30, 35, 38-40, 46-58, 61-63, 65, 66, 68-72, 76-83, 86-88, 93-100, 103-105, 108, 110, 112-115, 117, 119, 122-127, 130, 132-138, 140-157], although an inert atmosphere, such as argon, can be used [6,11,14,32,33,43,45,60,67,74,75,90,111,121,134,158,159]. On rare occasions, TLP bonding is performed under a different atmosphere, such as nitrogen [44], hydrogen [160], nitrogen and hydrogen [18], or open air [129].…”

Section: Tlp Bonding Processmentioning

confidence: 99%

Overview of transient liquid phase and partial transient liquid phase bonding

2011

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Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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Section: Tlp Bonding Processmentioning

confidence: 99%

Overview of transient liquid phase and partial transient liquid phase bonding

2011

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“…20 The different thermal expansion of different materials further causes more stress due to the density difference. 21,22 Accordingly, a number of researchers are now using Ni, 23,24 silver (Ag), 22,25 and copper (Cu)-based 7,26,27 interlayers to alleviate the stress concentration.…”

Section: Introductionmentioning

confidence: 99%

Diffusion welding of stainless steel 304L/Monel K-500 composite materials produced with different methods

Kejanlı

2020

Advanced Composites Letters

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The stainless steel 304L (commercially supplied) and Monel K-500 that was prepared through cold pressing of metal matrix composite materials powder mixtures were joined by diffusion welding. Welding was performed under uniaxial compression using the 50 µm-thick nickel (Ni) and aluminum (Al) 2024 interlayers under 3 MPa at 950–980°C for 60 min in an argon gas atmosphere. After welding, the diffusion and intermediate zones of the samples were characterized using X-ray diffraction, optical microscopy, scanning electron microscopy, and energy-dispersive spectrometry analysis. As evaluating the diffusion zone with interlayer, it was determined that different interlayers expanded due to increasing temperature of the diffusion area. Interlayers expanded more on the K-500 side and relatively less on the 304L side. On the other hand, when samples with Ni interlayers were examined, high amount of Ni contained by both base material (304L) and interlayer led to the formation of rich Ni phases in the diffusion side. The brittle FeNi, Fe3Ni2, CuNi, Cu9Si, Cu0,81Ni0,19, Fe0,64Ni0,36, CrNi, Cr2Ni3, FeNi3, FeCu4, and Al0.71Cr0.3Fe17.65, which were identified to form irregularity in the diffusion zone. These intermetallic phases increased the hardness and significantly decreased the ductility of different material couples joined by diffusion welding. As a result, the microhardness and lap shear tests were applied to specimens to characterize the mechanical properties of the joint zones. The maximum hardness and maximum lap shear values were obtained at joint that made with the Al interlayer at 980°C as 432.8 HV and 165 MPa.

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“…1,2 Another advantage of TLP bonding is that the bonding layer often has similar microstructures to the properties of the base material. 3,4 Some studies have reported that they are as strong as the base material or even stronger, causing the failure in the base material rather than in the joint. [5][6][7] Over the past few decades, the diffusion soldering process has been used for die-attach purposes such as Cu/Sn, Ni/Sn and Au/Sn.…”

Section: Introductionmentioning

confidence: 99%

Reliability Investigation of Cu/In TLP Bonding

Lee

Yuan

Rhee

2014

Journal of Elec Materi

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Die-attach bonding was evaluated using a transient liquid phase (TLP) bonding method on a Cu/In, Au/In and Cu-Sn3Ag metal stack. TLP bonding is a relatively low cost process since thin layers of material are used and, at the same time, has higher reliability due to the good thermal resistance of the intermetallic compounds (IMCs) formed. The bonded samples were aged at 300°C for 500 h and thermal cycled from −40°C to 125°C for 500 cycles. The results showed that the shear strength of the Cu/In joint was higher than that of the Au/In joint with increasing aging time. Cu/In specimens on a ceramic substrate also showed good reliability results during the thermal cycling test. Even though Cu/In TLP bonding is not popular in conventional electronics, it is suitable for high temperature electronics due to the simplicity of the IMC formation.

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Transient liquid phase (tlp) diffusion bonding of Ti45Ni49Cu6 P/M components using Cu interlayer

Cited by 17 publications

References 7 publications

Overview of transient liquid phase and partial transient liquid phase bonding

Overview of transient liquid phase and partial transient liquid phase bonding

Diffusion welding of stainless steel 304L/Monel K-500 composite materials produced with different methods

Reliability Investigation of Cu/In TLP Bonding

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