2011 Asian Test Symposium 2011
DOI: 10.1109/ats.2011.64
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Transient Noise Failures in SRAM Cells: Dynamic Noise Margin Metric

Abstract: Current nanometric IC processes need to assess the robustness of memories under any possible source of disturbance: process and mismatch variations, bulk noises, supply rings variations, temperature changes, aging and environmental aggressions such as RF or on-chip couplings. In the case of SRAM cells, the static immunity to such perturbations is well characterized by means of the Static Noise Margin (SNM) defined as the maximum applicable series voltage at the inputs which causes no change in the data retenti… Show more

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Cited by 5 publications
(2 citation statements)
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“…Re cently, many previous works proposed different analysis meth ods [6], [20], [21], [23] the tolerability of memory cell to the external noise and energy particle such as glitches, alpha and neutron particles causing SEDs that are not instantaneous.…”
Section: Dynamic Noise Margin (Dnm)mentioning
confidence: 99%
“…Re cently, many previous works proposed different analysis meth ods [6], [20], [21], [23] the tolerability of memory cell to the external noise and energy particle such as glitches, alpha and neutron particles causing SEDs that are not instantaneous.…”
Section: Dynamic Noise Margin (Dnm)mentioning
confidence: 99%
“…This means that DNM can more accurately quantify the tolerance of a memory cell to realistic external noise since SEUs from alpha and neutron particles have both temporal and voltage level components. Previous researchers have proposed many different analysis methods to compute DNM [8,22,23,25].…”
Section: Introductionmentioning
confidence: 99%