Transparent Barrier Coatings for Flexible Organic Light-Emitting Diode Applications

Wuu, Dong Sing; Chen, Tsai Ning; Wu, Ching-Chou; Chiang, C. C.; Chen, Yung Pei; Horng, Ray−Hua; Juang, Fuh−Shyang

doi:10.1002/cvde.200506436

Cited by 43 publications

(21 citation statements)

References 22 publications

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“…The devices degrade very quickly due to water vapour and oxygen. Therefore water vapour transmission rates (WVTR) and oxygen transmission rates (OTR) must be lower than respectively 10 −6 g·m −2 per day and 10 −3 cm 3 ·m −2 per day, indicating a very high barrier layer is necessary [ 6 ]. Some of the applied techniques to deposit the OLED layers are very expensive and not roll-to-roll compatible.…”

Section: Resultsmentioning

confidence: 99%

Printing Smart Designs of Light Emitting Devices with Maintained Textile Properties

et al. 2018

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To maintain typical textile properties, smart designs of light emitting devices are printed directly onto textile substrates. A first approach shows improved designs for alternating current powder electroluminescence (ACPEL) devices. A configuration with the following build-up, starting from the textile substrate, was applied using the screen printing technique: silver (10 µm)/barium titanate (10 µm)/zinc-oxide (10 µm) and poly(3,4-ethylenedioxythiophene)poly(styrenesulfonate) (10 µm). Textile properties such as flexibility, drapability and air permeability are preserved by implementing a pixel-like design of the printed layers. Another route is the application of organic light emitting devices (OLEDs) fabricated out of following layers, also starting from the textile substrate: polyurethane or acrylate (10–20 µm) as smoothing layer/silver (200 nm)/poly(3,4-ethylenedioxythiophene)poly(styrenesulfonate) (35 nm)/super yellow (80 nm)/calcium/aluminum (12/17 nm). Their very thin nm-range layer thickness, preserving the flexibility and drapability of the substrate, and their low working voltage, makes these devices the possible future in light-emitting wearables.

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Section: Resultsmentioning

confidence: 99%

Printing Smart Designs of Light Emitting Devices with Maintained Textile Properties

et al. 2018

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“…A single inorganic barrier layer generated by a vacuum processing provided an enhancement of two or three orders of magnitude over OTR for polymeric substrates [125]. Analogy to OLED packaging, barrier layers which are impermeable to oxygen and moisture, such as SiO x [125][126][127], SiN x [127], and A1 2 O 3 [128], have been utilized to form high gas-resistant substrates. To acquire a high coating quality of the barrier layer, the wetting compatibility between the polymer matrix and the barrier should be examined.…”

Section: Improving Stability Of Qds Against Oxygen Andmentioning

confidence: 99%

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

Xie

Qiu

Luo

2016

Journal of Electronic Packaging

152

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Recent years, semiconductor quantum dots (QDs) have attracted tremendous attentions for their unique characteristics for solid-state lighting (SSL) and thin-film display applications. The pure and tunable spectra of QDs make it possible to simultaneously achieve excellent color-rendering properties and high luminous efficiency (LE) when combining colloidal QDs with light-emitting diodes (LEDs). Due to its solution-based synthetic route, QDs are impractical for fabrication of LED. QDs have to be incorporated into polymer matrix, and the mixture is dispensed into the LED mold or placed onto the LED to fabricate the QD–LEDs, which is known as the packaging process. In this process, the compatibility of QDs' surface ligands with the polymer matrix should be ensured, otherwise the poor compatibility can lead to agglomeration or surface damage of QDs. Besides, combination of QDs–polymer with LED chip is a key step that converts part of blue light into other wavelengths (WLs) of light, so as to generate white light in the end. Since QD-LEDs consist of three or more kinds of QDs, the spectra distribution should be optimized to achieve a high color-rendering ability. This requires both theoretical spectra optimization and experimental validation. In addition, to prolong the reliability and lifetime of QD-LEDs, QDs have to be protected from oxygen and moisture penetration. And the heat generation inside the package should be well controlled because high temperature results in QDs' thermal quenching, consequently deteriorates QD-LEDs' performance greatly. Overall, QD-LEDs' packaging and applications present the above-mentioned technical challenges. A profound and comprehensive understanding of these problems enables the advancements of QD-LEDs' packaging processes and designs. In this review, we summarized the recent progress in the packaging of QD-LEDs. The wide applications of QD-LEDs in lighting and display were overviewed, followed by the challenges and the corresponding progresses for the QD-LEDs' packaging. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art QD-LEDs' packaging and application technologies.

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“…This equivalent deposition method compared to the PECVD used to form SiO x films makes it possible to deposit both the polymer and the oxide in the same vacuum chamber. SiO x thin films deposited on parylene C substrates using PECVD have proven valuable to date in order to further improve their barrier properties (Wuu et al, 2006;Potscavage et al, 2009;Hogg et al, 2014;Kim et al, 2014). PECVD from organosilane precursors may however lead to undesired organic contamination of the expected Si-O network and to a complex population of defects, and these two factors severely degrade the barrier performance (Roberts et al, 2002).…”

Section: Introductionmentioning

confidence: 99%

The Influence of Microstructure on Nanomechanical and Diffusion Barrier Properties of Thin PECVD SiOx Films Deposited on Parylene C Substrates

et al. 2019

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Plasma-enhanced chemical vapor deposition (PECVD) was used to deposit SiO x thin films of varying thicknesses on parylene C substrates, using hexamethyldisiloxane (HMDSO) as a precursor. The microstructure of SiO x coatings was analyzed using X-ray photoemission spectroscopy (XPS), nanoindentation, and spectroscopic ellipsometry. The composition ranged from oxygen-rich oxides with large silanol OH content to hybrid oxides with larger organic content, while refractive index varied from 1.45 to 1.5 depending on the specimen. Reduced moduli of coatings obtained by nanoindentation varied between 15 and 59 GPa and could be correlated with permeability to oxygen and water vapor through the existence of porosity in a broader sense. It can be concluded that the barrier properties are the result of a complex interplay of microstructural features, with porosity, silanol, and carbon content playing important roles in the final thin film properties.

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Transparent Barrier Coatings for Flexible Organic Light-Emitting Diode Applications

Cited by 43 publications

References 22 publications

Printing Smart Designs of Light Emitting Devices with Maintained Textile Properties

Printing Smart Designs of Light Emitting Devices with Maintained Textile Properties

Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives

The Influence of Microstructure on Nanomechanical and Diffusion Barrier Properties of Thin PECVD SiOx Films Deposited on Parylene C Substrates

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