2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) 2017
DOI: 10.1109/edtm.2017.7947561
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Transport properties in silicon nanowire transistors with atomically flat interfaces

Abstract: We have fabricated ultra-narrow (sub-10nm) short channel (100nm) silicon (Si) nanowire transistors with atomically flat interfaces based on Si-on-Insulator (SOI) substrates. The raised source and drain electrodes were patterned together with the gate electrode. The smaller threshold voltage in the narrower nanowire suggests self-limiting oxidation during the gate oxide formation.

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“…It is based on a one-dimensional silicon channel on top of a fully-depleted silicon-on-insulator wafer and exhibits a back-gate, two TiN side-gates, and an array of thin TiN top-gates. In contrast to the modified FinFET devices of [24,25,27], the channel is anisotropically wet-etched by tetramethylammonium hydroxide (TMAH), which results in a trapezoidal nano-ridge with atomically-flat {111} facets [30,31]. The angle of the tip of the trapezoidal nano-ridge can be further tuned by the local-oxidation of silicon (LOCOS) process of the {111} silicon facets.…”
Section: Device Conceptmentioning
confidence: 99%
“…It is based on a one-dimensional silicon channel on top of a fully-depleted silicon-on-insulator wafer and exhibits a back-gate, two TiN side-gates, and an array of thin TiN top-gates. In contrast to the modified FinFET devices of [24,25,27], the channel is anisotropically wet-etched by tetramethylammonium hydroxide (TMAH), which results in a trapezoidal nano-ridge with atomically-flat {111} facets [30,31]. The angle of the tip of the trapezoidal nano-ridge can be further tuned by the local-oxidation of silicon (LOCOS) process of the {111} silicon facets.…”
Section: Device Conceptmentioning
confidence: 99%