Tri-layer a-Si:H integrated circuits on polymeric substrates

Thomasson, D.B.; Bonse, M.; Huang, J.R.; Wroński, C. R.; Jackson, Thomas N.

doi:10.1109/iedm.1998.746348

Cited by 14 publications

(8 citation statements)

References 3 publications

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“…) [34]. The surface roughness of the polyimide (in this case Kapton) varies depending on the previous processing history, but for a typical sample is [35]. To ensure a basic level of adhesion, films were typically checked using a qualitative pull test with self-adhesive tape.…”

Section: Methodsmentioning

confidence: 99%

Printed microinductors on flexible substrates for power applications

Brandon

Wesseling

Chang

et al. 2003

IEEE Trans. Comp. Packag. Technol.

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A low-profile microinductor was fabricated on a copper-clad polyimide substrate where the current carrying coils were patterned from the existing metallization layer and the magnetic core was printed using a magnetic ceramic-polymer composite material. Highly loaded ferrite-polymer composite materials were formulated, yielding adherent films with 4 3900 G at +5000 Oe applied dc field. These composite magnetic films combine many of the superior properties of high temperature ceramic magnetic materials with the inherent processibility of polymer thick films. Processing temperatures for the printed films were between 100 C and 130 C, facilitating integration with a wide range of substrates and components. The quality factor of the microinductor was found to peak at = 18 5 near 10 MHz, within the optimal frequency range for power applications. A flat, nearly frequency independent inductance of 1.33 H was measured throughout this frequency range for a 5 mm 5 mm component, with a dc resistance of 2.6 and a resonant frequency of 124 MHz. The combination of printed ceramic composites with organic/polymer substrates enables new methods for embedding passive components and ultimately the integration of high inductors with standard integrated circuits for low profile power electronics.

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Section: Methodsmentioning

confidence: 99%

Printed microinductors on flexible substrates for power applications

Brandon

Wesseling

Chang

et al. 2003

IEEE Trans. Comp. Packag. Technol.

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“…Recently several groups have demonstrated thin film devices (amorphous silicon TFT's, organic LED's, …) on flexible substrates [4][5][6][7][8][9]. In these cases, the demonstrated flexibility is the cylindrical deformation, e.g.…”

Section: Deformation Strain and Its Mitigationmentioning

confidence: 99%

Deformable Electronic Surfaces

Sturm

Hsu

Glesková³

et al. 2006

Frontiers in Electronics

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In this paper a technological approach for the fabrication of deformable electronic surfaces is reviewed. The approach consists of the fabrication of thin film devices on a flat but deformable substrate such as a plastic or glass foil using conventional processing tools. After the fabrication, the foil can be deformed to other shapes by air pressure or stamping. A spherical cap shape is used as a model system. This deformation induces large stress in the substrate, which is plastically deformed. To avoid damage to the thin film devices, they are built on top of "hard" islands, which limit the strain in the devices to manageable levels. Amorphous silicon TFT's on silicon nitride islands show little qualitative change in characteristics after a plastic deformation of the substrate to strain levels over 5%. Interconnect lines between islands are subjected to a large strain if they are deposited and patterned before the substrate deformation, and require novel approaches.

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“…Recently there has been considerable interest in the development of thin flexible displays utilizing either steel or plastic based backplanes [1][2][3][4][5][6]. With the elimination of thin and fragile glass substrates, it becomes possible to develop new devices for the growing lightweight electronic products market.…”

Section: Introductionmentioning

confidence: 99%

“…Kapton is stable to most process chemicals and insoluble in organic solvents; the polymer has a glass transition temperature > 350ºC, a coefficient of thermal expansion of 12x10 -6 /ºC [8], and RMS surface roughness of ~ 30 nm [4] for the film. Kapton polyimide films also have low shrinkage: a 75-µm thick foil shrinks ~ 0.04% after 2 hours at 200ºC.…”

Section: Introductionmentioning

confidence: 99%

43.3: A Rugged Conformable Backplane Fabricated with an a‐Si:H TFT Array on a Polyimide Substrate

Forbes

Gelbman

Turner

et al. 2002

Symp Digest of Tech Papers

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Flexible active matrix TFT array backplanes were fabricated on 51 µm thick polyimide foil (KaptonE) substrates. Expected applications include low cost flexible lightweight displays using electrophoretic, OLED, and PDLC displays. TFT performance of the Kapton backplane is nearly identically to the same structure fabricated on a glass substrate. Measurement of the transfer and output characteristics while the sample was bent at an inward radius of curvature of 2.5 cm indicate no loss in TFT performance.

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Tri-layer a-Si:H integrated circuits on polymeric substrates

Cited by 14 publications

References 3 publications

Printed microinductors on flexible substrates for power applications

Printed microinductors on flexible substrates for power applications

Deformable Electronic Surfaces

43.3: A Rugged Conformable Backplane Fabricated with an a‐Si:H TFT Array on a Polyimide Substrate

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