“…Soon, better performances were obtained in the planar structure, where NiO hole selective layers (HSL) can be deposited using a vast range of techniques: sputtering, atomic layer deposition (ALD), e‐beam deposition, and NiO nanoparticles casting . The sol‐gel spin coating route is particularly appealing because of its low cost and because it offers the possibility to implement doping, by, e.g., copper, easily. Other doping elements, such as Li, Ag, Co, Zn, and Cs have also been successfully introduced into NiO, resulting in improved conductivity.…”