No abstract

No abstract

The advent of halide perovskite permitted significant progress in the field of III generation photovoltaics (PV), demonstrating a rapid growth of power conversion efficiency (PCE) up to 25.5% during the last decade. [1] This is mainly due to the peculiar properties of halide perovskites for photoelectric conversion: strong absorption in the visible region of the solar light spectrum, [2] defect tolerance, [3] big diffusion lengths of the charge carriers (>1 mm), [4] and tunability of the bandgap in the wide range (from 1.9 to 3.1 eV). [5] The improvement of perovskite solar cell (PSC) performance has been mainly driven by solution processing of the absorber films that allows simplifying the device fabrication at low temperature [6,7] by using various methods for the perovskite crystallization [8] and the control of morphology. [9] The cost-effective solution-based fabrication of the PSCs could be realized with various printing methods such as blade coating, [10,11] inkjet printing, [12] and slot-die, [13] which do not require the use of high vacuum and provide high throughput speed of production. Among the printing methods, the slot-die coating was considered as one of the most promising for upscale of the PSCs in sheetto-sheet and roll-to-roll fabrication. [13][14][15] This method of wet coating provides a high speed and large-area fabrication, [16] good film thickness control, highly uniform coating, and enables the effective ink consumption without materials loss during the deposition. [17,18] The upscaling of PSCs from lab-scale to large modules with an application of printing methods is a complex technological process that requires special fabrication conditions, including

NiO/perovskite interface with novel NiO precursor was investigated with Auger profiling for solar cell with PCE > 15%.

In this work, we show the route to obtain thermoplastic based composites with an enhanced thermal conductivity that was achieved by using exfoliated hexagonal boron nitride (hBN) particles as a filler material. Reports on composites with bulk or nano hBN showed, that while increasing the filler load improves thermal properties it could aggravate the composite melt rheology and mechanical properties. On the other hand, exfoliated hBN particles compared to bulk or nanopowder hBN could provide even better thermal properties with no degradation in composite mechanics, which was shown for epoxy. Taking into account the above, we obtained exfoliated hBN particles by ultrasound treatment in isopropyl alcohol and then used them as a filler in polypropylene based composites to increase the thermal conductivity. The composites with 29% wt. of exfoliated hBN showed a thermal conductivity of 0.721 W m−1 K−1 which is 4 times higher than for pristine polypropylene.