TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement

Xu, Fei; Yu, Yang; Xu, Kangkang; Peng, Xiyuan

doi:10.1109/access.2018.2879640

Cited by 12 publications

(2 citation statements)

References 20 publications

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“…15 Electrical inspection will usually be able to detect short-defect and open-defect that make changes in electrical parameters, greatly limiting the types of defects that can be detected. 16,17 With the gradual reduction of critical dimensions such as TSV, X-ray has found great application in practical applications with its resolution below 15 nm. First, the detection image is captured by an X-ray detector, and the image is processed by image processing techniques, 18 such as Canny operator and morphological modification, then a specific neural network model is trained by extracting the corresponding feature parameters.…”

Section: Introductionmentioning

confidence: 99%

Internal defect identification method of TSV 3D packaging based on built-in integrated sensor

Huang

Yin

Liu

et al. 2022

Advances in Mechanical Engineering

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TSV (Through Silicon Via) is a key technology for three-dimensional (3D) packaging due to its unique vertical interconnection method. However, its particular manufacturing process of-ten leads to internal defects, such as gaps, bottom voids, filling missing, which are usually difficult to be detected by common means. In order to discover the internal defect of TSV packaging effectively, a novel non-destructive inspection method based on built-in integrated temperature sensor array is proposed. The relationship between temperature distribution and internal defect is dis-covered and then corresponding sensor array layout is designed. The simulation analysis shows that this kind of sensor array can recognize the internal TSV defect. And supervised machine learning is used to construct the classification model by which different defects can be found and classified with relatively high accuracy, and the classification accuracy rate can reach 95.625%. Experiments were conducted and the rationality of this built-in sensing array was verified. The research provides a non-destructive testing method for TSV internal defects based on bulit-in-integrated sensors, and verifies the feasibility of sensor arrangement through simulation, laying a foundation for the realization of later TSV design optimization.

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Section: Introductionmentioning

confidence: 99%

Internal defect identification method of TSV 3D packaging based on built-in integrated sensor

Huang

Yin

Liu

et al. 2022

Advances in Mechanical Engineering

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“…This method requires very high microwave measurement accuracy. The destructive physical analysis (DPA) of sections is used in references [5] and [6]. However, in multilayer stacked 3D ICs, internal defects of 3D components may exist in the substrate.…”

Section: Introductionmentioning

confidence: 99%

Analytical and Measurement-Based Method for Diagnosing the Fault of Channels in TSV-Based 3D ICs

Zheng

Wang

et al. 2022

J. Phys.: Conf. Ser.

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Three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology can effectively solve many bottlenecks in the development of ICs. It has rapidly developed into a key cutting-edge technology representing the medium and long-term sustainable development of microelectronics industry. Process fluctuation causes TSV process defects, resulting in the change of structural parameters of RDL and TSV interconnection structure. Finally, it leads to the degradation of performance parameters and functional failure of 3D interconnection and devices. Aiming at the high-resistance and open-circuited faults of 3D ICs, this paper develops an analysis method based on micro nano machining and detection technology. The electrical characteristics and images of typical chain TSV interconnections are analyzed by scanning electron microscope high-resolution imaging. The mechanism of fault diagnosis is based on potential difference and electron transfer.

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An efficient partitioning and placement based fault TSV detection in 3D-IC using deep learning approach

Nair

Sivakumar

Nair

et al. 2021

J Ambient Intell Human Comput

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TSV-Defect Modeling, Detection and Diagnosis Based on 3-D Full Wave Simulation and Parametric Measurement

Cited by 12 publications

References 20 publications

Internal defect identification method of TSV 3D packaging based on built-in integrated sensor

Internal defect identification method of TSV 3D packaging based on built-in integrated sensor

Analytical and Measurement-Based Method for Diagnosing the Fault of Channels in TSV-Based 3D ICs

An efficient partitioning and placement based fault TSV detection in 3D-IC using deep learning approach

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