Tunable dielectric and other properties in high-performance sandwich-type polyimide films achieved by adjusting the porous structure

Ma, Yingyi; Xu, Le; He, Zian; Xie, Junwen; Shi, Lei; Zhang, Mingyan; Zhang, Wenlong; Cui, Weiwei

doi:10.1039/c9tc02017a

Cited by 53 publications

(41 citation statements)

References 57 publications

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“…Notably, the PI sponge film exhibited an ultralow dielectric constant of 2.0 and 1.99 at 1 and 30 MHz, respectively. This is because the presence of hierarchically porous structure in PI sponge film can introduce air voids, which have an extremely low k value of ~1.0 [ 24 ]. Furthermore, dielectric loss in PI sponge film obviously decreased in the high-frequency range.…”

Section: Resultsmentioning

confidence: 99%

Polymer Concentration and Liquid—Liquid Demixing Time Correlation with Porous Structure of Low Dielectric Polyimide in Diffusion-Driven Phase Separation

et al. 2022

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Porous polyimide (PI) films are a promising low-k dielectric material for high-frequency data transmission with low signal attenuation. Pores are generated by non-solvent induced phase separation (NIPS) during phase inversion of polymer solution via non-solvent accumulation and solvent diffusion. In this study, aromatic PI was employed as a matrix for NIPS, and the influence of polymer concentration and liquid—liquid demixing time on the morphology of pores in the PI films was investigated. This ensured control over the porous structure of the PI film and provided desirable dielectric properties in a broad frequency range of 100 Hz–30 MHz (1.99 at 30 MHz) and thermal stability (Td5% > 576 °C, Tg > 391 °C). This study addresses the effect of polymer concentration and coagulation time on the morphology and physical properties of PI sponge films and provides guidance on the design and optimization of architectures for polymeric materials requiring pore modification.

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Section: Resultsmentioning

confidence: 99%

Polymer Concentration and Liquid—Liquid Demixing Time Correlation with Porous Structure of Low Dielectric Polyimide in Diffusion-Driven Phase Separation

et al. 2022

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“…The characteristic peaks of imide groups, including C¼O asymmetrical and symmetrical stretching vibration at 1780 cm �1 and 1720 cm �1 , C¼C stretching vibration at 1500 cm �1 , C-N bond stretching vibration at 1380 cm �1 and C¼O bending vibration at 725 cm �1 are observed. 29 Meanwhile, amide carbonyl group stretching vibration of PAA at 1650 cm À1 is absent in the spectrum of PI@BT, indicating a complete imidization and formation of PI on the surface of BT nanoparticles. The XRD patterns of the two kinds of nanoparticles are displayed in Figure 2(b).…”

Section: Characterization Of Bt and Pi@bt Nanoparticlesmentioning

confidence: 97%

Enhanced dielectric properties and thermostability in polyimide composites with core-shell structured polyimide@BaTiO₃ nanoparticles

Deng

Ren

Wang

et al. 2021

High Performance Polymers

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Polymer composites with high dielectric constant and thermal stability have shown great potential applications in the fields relating to the energy storage. Herein, core-shell structured polyimide@BaTiO3 (PI@BT) nanoparticles were fabricated via in-situ polymerization of poly(amic acid) (PAA) and the following thermal imidization, then utilized as fillers to prepare PI composites. Increased dielectric constant with suppressed dielectric loss, and enhanced energy density as well as heat resistance were simultaneously realized due to the presence of PI shell between BT nanoparticles and PI matrix. The dielectric constant of PI@BT/PI composites with 55 wt% fillers increased to 15.0 at 100 Hz, while the dielectric loss kept at low value of 0.0034, companied by a high energy density of 1.32 J·cm−3, which was 2.09 times higher than the pristine PI. Moreover, the temperature at 10 wt% weight loss reached 619°C, demonstrating the excellent thermostability of PI@BT/PI composites. In addition, PI@BT/PI composites exhibited improved breakdown strength and toughness as compared with the BT/PI composites due to the well dispersion of PI@BT nanofillers and the improved interfacial interactions between nanofillers and polymer matrix. These results provide useful information for the structural design of high-temperature dielectric materials.

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“…Zhang obtained controllable porous materials by introducing hydroxy‐Boc‐assisted modification and thermal foaming 1 . There are many ways to form pore structure, such as pyrolysis foaming method, 1,27 chemical dissolution method, 28–30 microemulsion method, 31–34 immersion precipitation phase transformation method, 2 and so on 35–41 . Although the pore structure is introduced, the mechanical property of the film is greatly damaged.…”

Section: Introductionmentioning

confidence: 99%

Construction of porous poly (aryl sulfide sulfone) film with low dielectric constant and excellent mechanical property

Zhu

Wei

Wang

et al. 2022

J of Applied Polymer Sci

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The low dielectric constant and excellent mechanical property polymer film plays important roles in the high‐speed integrated circuits. In this work, porous poly (aryl sulfide sulfone) (PASS) films with different pore regularities and distributions were systematically fabricated via a combination process with solvent evaporation, wet induced phase separation, and hot pressing. It is found that the macroporous structure of PASS films changed from irregular shape with large pore size distribution to regular shape with small pore size distribution and the sponge‐like pore structure disappeared then formed a dense layer by controlling the time of solvent evaporation and hot pressing, to realize the effective control of the pore structure. The optimal PASS porous film D3 which was heated for 25 min and then hot pressed for 4 min has a low dielectric constant (2.44) and dielectric loss (0.010), high tensile strength (62.14 MPa) and breakdown strength (139.32 kV/mm), and low water absorption (0.54%). The comprehensive excellent properties are beneficial to the application of PASS films in microelectronic devices.

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Tunable dielectric and other properties in high-performance sandwich-type polyimide films achieved by adjusting the porous structure

Abstract: Excellent dielectric and other properties of PI films were realized and tuned through the introduction of a sandwich-type porous structure.

Cited by 53 publications

References 57 publications

Polymer Concentration and Liquid—Liquid Demixing Time Correlation with Porous Structure of Low Dielectric Polyimide in Diffusion-Driven Phase Separation

Polymer Concentration and Liquid—Liquid Demixing Time Correlation with Porous Structure of Low Dielectric Polyimide in Diffusion-Driven Phase Separation

Enhanced dielectric properties and thermostability in polyimide composites with core-shell structured polyimide@BaTiO₃ nanoparticles

Construction of porous poly (aryl sulfide sulfone) film with low dielectric constant and excellent mechanical property

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Tunable dielectric and other properties in high-performance sandwich-type polyimide films achieved by adjusting the porous structure

Abstract: Excellent dielectric and other properties of PI films were realized and tuned through the introduction of a sandwich-type porous structure.

Cited by 53 publications

References 57 publications

Polymer Concentration and Liquid—Liquid Demixing Time Correlation with Porous Structure of Low Dielectric Polyimide in Diffusion-Driven Phase Separation

Polymer Concentration and Liquid—Liquid Demixing Time Correlation with Porous Structure of Low Dielectric Polyimide in Diffusion-Driven Phase Separation

Enhanced dielectric properties and thermostability in polyimide composites with core-shell structured polyimide@BaTiO3 nanoparticles

Construction of porous poly (aryl sulfide sulfone) film with low dielectric constant and excellent mechanical property

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Enhanced dielectric properties and thermostability in polyimide composites with core-shell structured polyimide@BaTiO₃ nanoparticles