“…This concept was extended, replacing the permanent adhesive between adjacent layers in a composite beam structure with reversible electrostatic bonding (Bergamini, 2009;Bergamini et al, 2006Bergamini et al, , 2007. The potential applications for EBL devices are numerous, including morphing structure applications (Previtali et al, 2015;Raither et al, 2012Raither et al, , 2013Raither et al, , 2014, vibration suppression (Bergamini et al, 2006(Bergamini et al, , 2007, or variable stiffness functionality (Di Lillo et al, 2013;Heath et al, 2016a). Significant progress has been made in increasing the level of electrostatic holding force generated, with greater understanding of thin film dielectrics used for EBL devices (Di Lillo et al, 2011) and improved close contact between structurally integrated electrodes through fabrication process enhancements (Heath et al, 2016a).…”