2019
DOI: 10.1016/j.apsusc.2018.11.153
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Tuning the stoichiometry and electrical properties of tantalum oxide thin films

Abstract: Tantalum oxide has a wide range of applications and has drawn much attention especially for its useful properties in resistive random-access memories, in which the Ta oxide composition plays an important role to control the electrical properties of the TaO x thin films. In this paper, we present a way to tune the composition of TaO x thin films by varying the oxygen partial pressure during growth using pulsed laser deposition. TaO x thin films were deposited at room temperature, under oxygen partial pressures … Show more

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Cited by 23 publications
(16 citation statements)
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“…This corresponds to the so-called "plateau" region wherein ρ is approximately linear with O content, which has previously been observed for TaO x films made by the "triode" sputtering technique [13,14]. The dependence becomes strong, close-to-exponential in the second region of O content within ∼50-70 at.%, consistent with previous reports [13,28,29]. The third region is for O content of 70 at.%, when the film composition approaches that of stoichiometric Ta 2 O 5 and ρ experiences a rapid increase, where most films with O content above ∼70 at.% had ρ values that were too high to be measured with our (direct-current) setup.…”
Section: Resultssupporting
confidence: 89%
“…This corresponds to the so-called "plateau" region wherein ρ is approximately linear with O content, which has previously been observed for TaO x films made by the "triode" sputtering technique [13,14]. The dependence becomes strong, close-to-exponential in the second region of O content within ∼50-70 at.%, consistent with previous reports [13,28,29]. The third region is for O content of 70 at.%, when the film composition approaches that of stoichiometric Ta 2 O 5 and ρ experiences a rapid increase, where most films with O content above ∼70 at.% had ρ values that were too high to be measured with our (direct-current) setup.…”
Section: Resultssupporting
confidence: 89%
“…32 This allows to tailor and control the properties resulting from oxygen vacancies in a dynamic manner via electric fields, temperature, pressure, or light by forming/healing defects or by moving and redistributing defects within the device. 3,29,[33][34][35][36][37][38][39][40][41][42][43] This area, currently known as defect engineering, is aimed at manipulating the nature and the concentration of defects in a material to tune its properties in a desired manner or to generate completely new and unexpected properties. 16,17 The formation and annihilation of oxygen vacancies in transition metal oxides involves the dynamics of ionic defects, the exchange of oxygen from or into the surrounding, and the transfer of electronic charges from or into the material, rendering oxygen vacancy formation a complex solid-state redox-process.…”
mentioning
confidence: 99%
“…is the step function. The authors in [37][38][39] customised the parameters of a memristor by adjusting the process recipe such as manipulating the thin-film growth conditions, variation of annealing time after deposition, variation of partial pressure of oxygen gas, etc. A memristor with multilevel stable resistance states from 1 to 200 kΩ has been reported in [37].…”
Section: Memristormentioning
confidence: 99%