2020
DOI: 10.1002/cta.2731
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Tunnel FET‐based ultralow‐power and hardware‐secure circuit design considering p‐i‐n forward leakage

Abstract: Summary Tunnel field‐effect transistor (TFET) exhibits significant p‐i‐n forward leakage with the increase in drain‐to‐source voltage bias, and this adversely impacts the power consumption and reliability of TFET digital circuits. This work presents low‐power circuit techniques that result in novel compact gates and recommends tristate gates to mitigate the leakage effects. The proposed novel compact gates and tristate gates demonstrate two and six times lower power consumption compared with conventional TFET … Show more

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Cited by 5 publications
(3 citation statements)
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“…[ 160 ] Additionally, an all‐spin logic device which utilized the variation in magnetization direction to change the circuit functionality without changing the overall device structure was also successfully demonstrated. [ 161 ] Other obfuscation techniques involving TFETs, [ 162 ] amorphous resistance change in PCM cells, [ 163 ] intrinsic stochasticity and polymorphism of giant spin‐Hall effect (GSHE) switches, [ 164 ] and ferroelectric active interconnects [ 165 ] have also been successful. More recently, independent from exploiting defects, obfuscation techniques based on 2D materials such as graphene, BP, and TMDs which rely on the intrinsic ambipolar transport and the substitutional doping of channel materials have been demonstrated.…”
Section: D‐material‐based Camouflagingmentioning
confidence: 99%
See 1 more Smart Citation
“…[ 160 ] Additionally, an all‐spin logic device which utilized the variation in magnetization direction to change the circuit functionality without changing the overall device structure was also successfully demonstrated. [ 161 ] Other obfuscation techniques involving TFETs, [ 162 ] amorphous resistance change in PCM cells, [ 163 ] intrinsic stochasticity and polymorphism of giant spin‐Hall effect (GSHE) switches, [ 164 ] and ferroelectric active interconnects [ 165 ] have also been successful. More recently, independent from exploiting defects, obfuscation techniques based on 2D materials such as graphene, BP, and TMDs which rely on the intrinsic ambipolar transport and the substitutional doping of channel materials have been demonstrated.…”
Section: D‐material‐based Camouflagingmentioning
confidence: 99%
“…SiNW FETs [212] Tunable polarity Camouflaging Low area Limited subthreshold swing TFET [162,212] p-i-n forward current/tunable polarity Camouflaging/TRNG Resilience to RE attacks, low power and compact Low ON current and high capacitance effects PCM [163] Cell resistance variation Camouflaging/TRNG/PUF/ tamper detection Resilience to imaging (SEM), low area High-programming current values GSHE [164] Tunable stochastic nature Camouflaging Resilient to Boolean SAT attacks Limited reliability and retention 2D materials [5,16,118] variations, in addition to their resilience against ML attacks based on Fourier regression models and adversarial DNNs. Finally, the future outlook of 2D technology was discussed along with its current status, challenges, mitigation strategies, and their possible implications toward developing secure hardware platforms. )…”
Section: High Write and Current Valuesmentioning
confidence: 99%
“…32,33 Orthogonal to this, the p-i-n forward current of TFET is explored as favorable feature to enhance the hardware security of circuits/systems. [34][35][36] In the recent works, authors have proposed TFET p-i-n forward based TRNG design that shows higher resilience towards reverse engineering attacks. 34 Leveraging the p-i-n forward current, TFET-based differential power analysis resistant crypto circuits have been demonstrated that achieve lower area overhead.…”
Section: Introductionmentioning
confidence: 99%