2006
DOI: 10.1109/led.2006.884715
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Tunnel Oxide Growth on Silicon With “Wet Nitrous Oxide” Process for Improved Performance Characteristics

Abstract: In this letter, the authors present the process, growth kinetics, and electrical characteristics of tunnel oxides grown by furnace oxidation of silicon at 800 • C in an ambient of nitrous oxide (N 2 O) and water vapor. Tunnel oxides of thickness 82-92 Å are grown by this "wet N 2 O oxidation" process, and the electrical characteristics such as the capacitance-voltage, current-voltage, voltage ramp, time-dependent dielectric breakdown, and charge to breakdown are evaluated using MOS capacitor as the diagnostic … Show more

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Cited by 5 publications
(2 citation statements)
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“…The survey also showed that it involved rather high temperature processes. In this paper we first give a brief account of a low temperature nitridation technology recently developed in our laboratory [19]. This process enables the growth of reliable tunnel oxides of thickness in the range 6 In this 'wet N 2 O' oxidation process, (100) p-type silicon is oxidized in a furnace at 800°C , in a gas mixture of N 2 O and water vapor by passing into the furnace 20 liters of N 2 O and 20 liters of N 2 bubbled thorough deionized (D.I.)…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The survey also showed that it involved rather high temperature processes. In this paper we first give a brief account of a low temperature nitridation technology recently developed in our laboratory [19]. This process enables the growth of reliable tunnel oxides of thickness in the range 6 In this 'wet N 2 O' oxidation process, (100) p-type silicon is oxidized in a furnace at 800°C , in a gas mixture of N 2 O and water vapor by passing into the furnace 20 liters of N 2 O and 20 liters of N 2 bubbled thorough deionized (D.I.)…”
Section: Introductionmentioning
confidence: 99%
“…The presence of N 2 O enables incorporation of controlled quantities of nitrogen into the oxide during the wet oxidation process which can be carried out at temperatures in the range 750 to 800°C to achieve oxide thickness control. Based on detailed experimental studies with this process it has been established [19] that oxide thickness ranging from 2 nm to 9.5 nm can be achieved with very good uniformity on silicon cut pieces of 2 cm 2cm × size. The role played by N 2 O on the oxidation process is indeed ascertained by an increase in the oxidation rate observed [20] as shown in Fig.1 when the N 2 O gas flow rate is increased from 0 to 20 liters per hour while the flow rate of N 2 bubbled through de-ionized (D.I.)…”
Section: Introductionmentioning
confidence: 99%