The negative differential
resistance (NDR) tunnel diodes are promising
alternative devices for beyond-CMOS (complementary metal oxide semiconductor)
computing because they offer several potential applications when integrated
with transistors. We propose a semiconductor-free NDR tunnel diode
concept that exhibits an ultrahigh peak-to-valley current ratio (PVCR)
value. Our proposed NDR diode consists of two cold metal electrodes
separated by a thin insulating tunnel barrier. The NDR effect stems
from the unique electronic band structure of the cold metal electrodes;
i.e., the width of the isolated metallic bands around the Fermi level
as well as the energy gaps separating higher- and lower-lying bands
determine the current–voltage (I–V) characteristics and the PVCR value of the tunnel diode.
By proper choice of the cold metal electrode materials, either a conventional
N-type or Λ-type NDR effect can be obtained. Two-dimensional
(2D) nanomaterials offer a unique platform for the realization of
proposed NDR tunnel diodes. To demonstrate the proof of concept, we
employ the nonequilibrium Green function method combined with density
functional theory to calculate the I–V characteristic of the lateral (AlI2/MgI2/AlI2) and vertical (NbS2/h-BN/NbS2) heterojunction tunnel diodes based on 2D cold metals. For
the lateral tunnel diode, we obtain a Λ-type NDR effect with
an ultrahigh PVCR value of 1016 at room temperature, while
the vertical tunnel diode exhibits a conventional N-type NDR effect
with a smaller PVCR value of about 104. The proposed concept
provides a semiconductor-free solution for NDR devices to achieve
the desired I–V characteristics
with ultrahigh PVCR values for memory and logic applications.