“…However, when the feed rate or depth of cut exceeds a critical specific value, the material in the workpiece changes from defined ductile to undefined brittle mode [4,5,6,7,8]. This means that when the undeformed chip thickness is reduced to sub-micron level, ductile machining can be achieved [3,9,10,11,12,13,14,15,16]. Using diamond tools with a negative rake angle, material can be removed through plastic shear, leaving a crack-free machined surface.…”