atomic-scale switches and transistors working at gigahertz frequencies using mechanically cleaved graphene, [3,4] ballistic transport of electrons in graphene-boron nitride heterostructures, [5] ambipolar transport in transition metal dichalcogenides and black phosphorus. [6][7] In contrast to the correlated high thermal and electrical conductivity as in carbon nanotubes or graphene, [8][9] h-BN offers a startlingly different combination of high thermal conductivity and excellent electrical insulation. [10] While the field gained attention with fabrication procedures that are easily realizable, it is the chemical vapor deposition (CVD) technique that truly made the surge ahead, especially because monolayers of large enough dimensions can be obtained. [11][12][13] The importance of aligning liquid crystal (LC) molecules for fabricating a liquid crystal display device needs hardly any emphasis. Indeed, the success mentioned above provided the impetus to employ CVD-grown 2D films as alignment layers for LC molecules. However, it has been realized that the CVD technique suffers from drawbacks such as high operational temperature, need for vacuum, usage of hazardous chemicals, and limited film thickness. [14] Besides, the process is timeconsuming as well as expensive, not to mention the high skills necessary to obtain good quality CVD-grown films. [14] It is with this background that solution processing (SP) of 2D materials, which can address the aforementioned issues in a simple and cost-effective way, is being currently considered as a viable alternative. [15] More importantly, the SP can also offer the possibility of fabricating large-area flexible devices. [16] It may be noted that the SP route has already helped to realize a plethora of devices including capacitors, supercapacitors, transistors, photodetectors, etc. [17][18][19] Despite the simplicity, the performance of the solution-processed electronic devices is reported to be inferior to those obtained by the CVD method. [20][21][22] The compromising device performance being the major hindrance for commercialization of the SP devices, it would be a significant step forward Fabrication of liquid crystal devices heavily relies on the alignment layer providing the mandatory unidirectional orientation of the nematic molecules. Drawbacks of the traditional mechanically rubbed polymer layer have prompted to find better alternatives. However, cost-effective methods for large-area unidirectional alignment are still elusive. The latest attempt has been to use 2D materials deposited through the well-known chemical vapor deposition process, invariably inviting all the associated complexities including high-temperature processing, cumbersome transfer onto the required substrate, etc. Most importantly, the achieved domain size over which the nematic molecules exhibit unidirectional planar orientation, has been too small (sub-mm 2 ) for employable devices. Here, the authors present a room temperature solution process for obtaining h-BN dispersion and directly depositing it...